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Water retaining device for circuit board to pass through copper bath

A technology of water retaining device and circuit board, which is applied in the direction of electrolysis process and electrolysis components, etc. It can solve the problems of large-scale generation of air bubbles, waste of electric energy, jamming and other problems, and achieve the effects of saving loss, improving production safety, and simple structure

Active Publication Date: 2012-08-29
KUNSHAN DONGWEI MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the present invention provides a water retaining device with copper grooves passing through the circuit board, which can effectively solve the waste of electric energy, the generation of a large number of air bubbles and the jamming phenomenon

Method used

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  • Water retaining device for circuit board to pass through copper bath
  • Water retaining device for circuit board to pass through copper bath
  • Water retaining device for circuit board to pass through copper bath

Examples

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Embodiment

[0013] Embodiment: A water retaining device for a copper groove passing through a circuit board, comprising longitudinal first and second water retaining wheel seats 1 and 2, and the first and second water retaining seats are respectively provided with longitudinal first and second water retaining wheels. Arc grooves 11,12, the first and second arc grooves are oppositely arranged, and are provided with the first and second water retaining rollers 3,4 that are longitudinal, and the first and second water retaining rollers rotate respectively on the first 1. In the second arc-shaped groove, the first and second water retaining rollers are elastic bodies, and the first and second water retaining rollers are in relative line contact, and the relative line contact parts of the first and second water retaining rollers can just seal the liquid in the copper tank ; The centers of the first and second retaining rollers are respectively fixed with first and second rollers 13 and 14;

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Abstract

The invention discloses a water retaining device for a circuit board to pass through a copper bath. The device comprises a first water retaining wheel seat and a second water retaining wheel seat which are longitudinal, wherein the first water retaining wheel seat and the second water retaining wheel seat are provided with a first arc-shaped groove and a second arc-shaped groove which are longitudinal respectively; the first arc-shaped groove and the second arc-shaped groove are oppositely arranged and are also provided with a first water retaining roller and a second water retaining roller which are longitudinal; the first water retaining roller and the second water retaining roller are rotatablely arranged in the first arc-shaped groove and the second arc-shaped groove respectively; the first water retaining roller and the second water retaining roller are elastomers; relative lines of the first water retaining roller and the second water retaining roller contact; and the contact part of the relative lines of the first water retaining roller and the second water retaining roller can exactly seal a liquid in the copper bath. The first roller and the second roller can freely rotate, no board blocking phenomenon appears when the circuit board passes through the device; and the liquid in the copper bath is always difficult to seep between contact surfaces of the first roller and the second roller of the device, and a large amount of bubble cannot be produced in a reflux tank, thereby providing safe and reliable technical guarantee for entering / exiting the copper bath of the circuit board, promoting the whole electroplating effect and production safety, and saving the loss of energy sources.

Description

technical field [0001] The invention relates to a water retaining device installed on a copper tank for electroplating. Background technique [0002] At present, in vertical continuous electroplating, the common method is that the circuit board directly enters and exits the copper tank. This method has many disadvantages: ①Because the inlet and outlet of the copper tank are completely open, the water flow at the inlet and outlet is too large. When there is no need to work, in order to ensure the circulation flow, it is necessary to add a filter to meet this requirement, wasting electric energy. ② A large amount of water flow dives into the backflow tank, causing a large number of air bubbles in the backflow tank. These bubbles dissipate in a short time and are brought into the copper tank by the strong water flow. Some of these bubbles are sucked by the filter. Long-term use is harmful to The filter has a certain loss, and at the same time, the filter will drive too many ai...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D5/00
Inventor 刘建波
Owner KUNSHAN DONGWEI MACHINERY CO LTD