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Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same

An organic additive, copper-tin-zinc technology, used in the field of alloy electroplating, can solve problems such as danger, and achieve the effects of good solderability, strong anti-discoloration ability, and white color.

Inactive Publication Date: 2010-01-13
佛山市光远科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art, in order to improve the electroplating performance of the silver-white multi-element alloy based on copper, tin and zinc, certain heavy metals are added in the electroplating additives, such as lead, bismuth, etc., but whether it is lead or other metals (except potassium and sodium) ) exist (EU ROHS Directive) or may be dangerous, such as trivalent chromium, antimony, vanadium, rare earth metals or radioactive metals, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The parameters of the rack plating bath and the contents of each component are as follows:

[0044] Cu 2+ 7-15g / L

[0045] sn 4+ 15-35g / L

[0046] Zn 2+ 0.2-0.6g / L

[0047] KOH or NaOH 10-25 g / L

[0048] Free NaCN or KCN 35-45 g / L

[0049] Surfactant 0.5-1 g / L

[0050] Organic complexing agent 3-25 g / L

[0051] Organic depolarizer 2-30 g / L

[0052] PH 14

[0053] Temperature 45-60°C.

[0054] There is an interactive relationship between the contents of each component of the plating solution. The copper salt and tin salt can be changed in a certain proportion. Of course, the appearance of the plating layer will produce light silver, dark silver, silver white, etc. Surfactants, organic complexing agents, and organic depolarizers can be changed in a certain proportion, and these three can be arbitrarily high or low; of course, the appearance of the coating will produce different color effects.

Embodiment 2

[0056] The parameters of the barrel plating bath and the contents of each component are as follows:

[0057] Cu 2+ 4-9g / L

[0058] sn 4+ 10-30g / L

[0059] Zn 2+ 0.25-0.6g / L

[0060] KOH or NaOH 8-20 g / L

[0061] Free NaCN or KCN 25-40 g / L

[0062] Surfactant 0.1-1.5 g / L

[0063] Organic complexing agent 3-15 g / L

[0064] Organic depolarizer 2-25 g / L

[0065] PH 14

[0066] Temperature 30-45°C.

[0067] There is an interactive relationship between the contents of each component of the plating solution. The copper salt and tin salt can be changed in a certain proportion. Of course, the appearance of the plating layer will produce light silver, dark silver, silver white, etc. Surfactants, organic complexing agents, and organic depolarizers can be changed in a certain proportion, and these three can be arbitrarily high or low; of course, the appearance of the coating will produce different color effects.

[0068] Although t...

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PUM

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Abstract

The invention provides a Cu-Sn-Zn plating solution containing organic addition agent and an electroplating technique utilizing same; the plating solution has the parameters and the content of all components: 4-15g / L of Cu<2+>, 6-42g / L of Sn<4+>, 0.15-1g / L of Zn<2+>, 6-35g / L of KOH or NaOH, 20-60g / L of free NaCN or KCN, 0.05-2.5g / L of surface active agent, 1-30g / L of organic complexing agent and 0.5-35g / L of organic depolarizing agent; the pH value is more than 12, and the temperature is 30-65 DEG C. The practicability examination is carried out on the plating solution and the technical finished product, and the examination proves that plating layer under the technique of the addition agent has bright white color and achieves the effect of replacing nickel; the discoloration preventing capability is better, experimental effect of neutral salt spray resistance is good, and the solderability is excellent; furthermore, the plating layer contains no harmful substances such as heavy metal, cyanide, etc.

Description

technical field [0001] The invention relates to the technical field of alloy electroplating, in particular to a plating solution without any metal components (except sodium and potassium) organic additives and a process for electroplating using the plating solution, which can electroplate a layer mainly composed of copper, tin and zinc. Silver-white multi-component alloy coating. Background technique [0002] In the prior art, in order to improve the electroplating performance of the silver-white multi-component alloy based on copper, tin and zinc, certain heavy metals, such as lead and bismuth, are added in the electroplating additives, but whether it is lead or other metals (except potassium and sodium) ) exist in reality (EU ROHS Directive) or may be dangerous, such as trivalent chromium, antimony, vanadium, rare earth metals or radioactive metals. It is inevitable to find an organic additive that does not contain any metal except potassium and sodium. Invention conten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/60C25D3/58
Inventor 杜强
Owner 佛山市光远科技有限公司
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