Coating method and coating apparatus
A coating method and a coating technology, which are applied to the surface coating liquid device, spraying device, spraying device, etc., can solve the problems of resist liquid filling, no universality, uneven strip coating, etc. , to achieve the effect of preventing uneven coating and uniform film thickness
Inactive Publication Date: 2012-04-25
TOKYO ELECTRON LTD
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Problems solved by technology
However, this method is not universal. Every time the situation (such as film thickness) and conditions (such as the type of resist) change, the hardware of the resist nozzle must be replaced, which has great practicality in terms of cost and use. lack of
[0011] Also, the existing rotation-free methods, such as Figure 26 As shown, when pre-spraying at the coating start position A, the gap between the resist nozzle 202 and the substrate G cannot be completely filled with the resist liquid, and a gap (poor liquid landing) 206 often occurs.
Start the coating scan in a certain state where the poor liquid landing 206 exists, such as Figure 27 As shown, the top line (wet line: wet line) of the meniscus formed at the lower part of the back surface of the resist nozzle 202 is depressed at the poor landing point 206, and is easily located at the position of the resist coating film 200 corresponding to the position. Striped coating unevenness along the scanning direction 208
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[0108] That is, at the coating start position A, since the gap between the long nozzle 82 and the substrate G is narrowed, the pre-spray or liquid landing of the resist liquid is performed, so the resist sprayed from the slit-shaped discharge port of the long nozzle 82 The liquid tends to spread excessively outward on the substrate G (in particular, outward in the long-hand direction of the nozzle). However, in this embodiment, the linear resist coating film 76 is already formed at the edge of the coating region RE. Thus, if Figure 9 As shown, because the outer edge of the planar resist coating film 100 is limited by the banks of the linear resist coating film 76, it cannot expand outward (bank effect), as shown by the phantom line 100'. The thinning (sag) of the film thickness is hindered. In particular, if Figure 8 As shown in the enlarged figure LA of the circled part in , in the pattern where the corners of the linear resist coating film 76 are rounded on the side of ...
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The present invention relates to a coating method and a coating apparatus, which facilitate the control to the film thickness of a coating film, particularly equalizes the film thickness in a peripheral part. According to the coating method, a processed substrate and the ejection opening of an elongated nozzle are approximately horizontally aligned and spaced spaced by a small clearance. The treating liquid is injected from the nozzle to the substrate while coating scaning causing the movement of the mozze in a relatively horizontal direction is performed. A surface-shaped coating film of thetreating liquid is formed on the substrate. At the periphery of the position while the coating scanning on the substrate is termined, before the coating scanning is performed, the pre-applied coatingfilm formed by the treating liquid is caused to become an anticipated pattern. A terminal which performs coating scanning to the plane-shaped coating film on the substrate is firstly combined with the pre-applied coating film, and the pre-applied coating film becomes an extension part of the plane-shaped coating film.
Description
[0001] This case is filed on May 30, 2006 , the application number is 200610085007.3 , the name of the invention is Coating method and coating device divisional application of the patent application. technical field [0002] The invention relates to a technology for coating a liquid on a substrate to be processed, in particular to a coating method and a coating device for forming a coating film on a substrate in a non-rotational manner. Background technique [0003] Recently, in the photolithography (photolithography) process of the flat panel display (FPD) manufacturing process, as a resist (resist) coating method that is conducive to the enlargement of the substrate (such as a glass substrate) to be processed, there has been widespread: The resist nozzle sprays the resist liquid in a strip shape from its slit-shaped nozzle, while moving or scanning the substrate relatively, without rotational movement, and coating the resist liquid on the substrate to form a desired fil...
Claims
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IPC IPC(8): G03F7/16
CPCB05B1/005B05B1/02B05C11/10H01L21/6715
Inventor 藤田直纪
Owner TOKYO ELECTRON LTD