Coating method and coating device
A coating method and a technology of a coating device, which are applied in the direction of photoplate-making process coating equipment, etc., can solve problems such as lack of universality, filling of resist liquid, uneven strip coating, etc., and achieve uniform film thickness Easy to prevent uneven coating
Inactive Publication Date: 2006-12-06
TOKYO ELECTRON LTD
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However, this method is not universal. Every time the situation (such as film thickness) and conditions (such as the type of resist) change, the hardware of the resist nozzle must be replaced, which has great practicality in terms of cost and use. lack of
[0010] Also, the existing rotation-free methods, such as Figure 26 As shown, when pre-spraying at the coating start position A, the gap between the resist nozzle 202 and the substrate G cannot be completely filled with the resist liquid, and a gap (poor liquid landing) 206 often occurs.
Start the coating scan in a certain state where the poor liquid landing 206 exists, such as Figure 27 As shown, the top line (wet line: wet line) of the meniscus formed at the lower part of the back surface of the resist nozzle 202 is depressed at the poor landing 206, and is easily located at the position of the resist coating film 200 corresponding to the position. Striped coating unevenness along the scanning direction 208
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[0107] That is, at the coating start position A, since the gap between the long nozzle 82 and the substrate G is narrowed, the pre-spray or liquid landing of the resist liquid is performed, so the resist sprayed from the slit-shaped discharge port of the long nozzle 82 The liquid tends to spread excessively outward on the substrate G (in particular, outward in the long-hand direction of the nozzle). However, in this embodiment, the linear resist coating film 76 is already formed at the edge of the coating region RE. Thus, if Figure 9 As shown, because the outer edge of the planar resist coating film 100 is limited by the banks of the linear resist coating film 76, it cannot expand outward (bank effect), as shown by the phantom line 100'. The thinning (sag) of the film thickness is hindered. In particular, as shown in the enlarged view LA of the inside of a circle in FIG. 8 , in a pattern in which the corners of the linear resist coating film 76 are rounded on the side of th...
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The invention relates to a coating method which is characterized in that it is easy to control membrane thickness of coated membrane, especially for homogenization of peripheral membrane thickness. It comprises following steps: loading base plate (G) on objective table (80) in planar coating unit (ACT) to drive resists supply device (86) and injection nozzle moving construction (88) to work, forming planar coating membrane (100) of resists on base plate from one end to the other through coating scan of long injection nozzle (82); the planar resists coating membrane (100) contacting with liner coating membrane during expansion to outer side of base plate (G) and integrating with it, the outer position of planar resists coating membrane is determined by liner coating membrane and the membrane thickness is controlled.
Description
technical field [0001] The invention relates to a technology for coating a liquid on a substrate to be processed, in particular to a coating method and a coating device for forming a coating film on a substrate in a non-rotational manner. Background technique [0002] Recently, in the photolithography (photolithography) process of the flat panel display (FPD) manufacturing process, as a resist (resist) coating method that is conducive to the enlargement of the substrate (such as a glass substrate) to be processed, there has been widespread: The resist nozzle sprays the resist liquid in a strip shape from its slit-shaped nozzle, while moving or scanning the substrate relatively, without rotational movement, and coating the resist liquid on the substrate to form a desired film Thick non-rotation method (for example, refer to Patent Document 1). [0003] Even in the resist process using the non-rotation method (also known as the slit method), cleaning treatment and adhesion tr...
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Inventor 藤田直纪
Owner TOKYO ELECTRON LTD