Polydomain array method of multiple light-emitting diode chips under single lens

A light-emitting diode and single-lens technology, applied in the field of multi-domain arrangement, can solve problems such as inconvenience and poor light mixing effect, and achieve the effect of uniform light mixing and reducing the overall volume

Inactive Publication Date: 2010-03-31
HELIO OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] like Figure 4A As shown, due to the relative arrangement position of the LED chips of different colors in space, and the influence of the mirror axis 11 of the hemispherical lens 10 and the direction of the light-emitting axis 12 of each LED chip, the light is emitted under the hemispherical lens 10. The light patterns of the red light-emitting diode chip, green light-emitting diode chip and blue light-emitting diode chip are as follows Figure 4B , Figure 4C and Figure 4D As shown, it is an asymmetrical light type, so polarized light is gen

Method used

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  • Polydomain array method of multiple light-emitting diode chips under single lens
  • Polydomain array method of multiple light-emitting diode chips under single lens
  • Polydomain array method of multiple light-emitting diode chips under single lens

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Example

[0090]

[0091] See Figure 5 , Image 6 , Figure 7 , Figure 8A , Figure 8B , 8C , Figure 8D , Picture 9 As shown, Figure 5 It is an embodiment of the process S10 of the multi-domain arrangement method S10 of multiple light-emitting diode chips under a single lens of the present invention Figure one . Image 6 It is a three-dimensional decomposition embodiment S10 of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention Figure one . Figure 7 It is the S10 embodiment of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention Figure one . Figure 8A Yes Figure 7 The three-dimensional embodiment diagram. Figure 8B Yes Figure 7 The red chip in the light pattern diagram. Figure 8C Is along Figure 8A The light emission pattern of the red chip in the direction of arrow A. Figure 8D Is along Figure 8A The light emission pattern of the red chip in th...

Example

[0099]

[0100] See Picture 10 , Picture 11 , Picture 12 , Figure 13 , Figure 14 As shown, Picture 10 It is an embodiment of the process S10' of the multi-domain arrangement method S10' of multiple light-emitting diode chips under a single lens of the present invention Figure II . Picture 11 It is a three-dimensional decomposition embodiment S10' of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention Figure II . Picture 12 It is a S10' embodiment of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention Figure three . Figure 13 It is the fourth embodiment of the S10' embodiment of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention. Figure 14 It is a S10' embodiment of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present in...

Example

[0111]

[0112] See Figure 15 , Figure 16 , Figure 17 As shown, Figure 15 It is a process embodiment of the method S10" for multi-domain arrangement of multiple light-emitting diode chips under a single lens of the present invention Figure three . Figure 16 It is a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention S10" stereo decomposition embodiment Figure three . Figure 17 It is an S10" embodiment of a multi-domain arrangement method of multiple light-emitting diode chips under a single lens of the present invention Figure Six .

[0113] Such as Figure 15 As shown, this embodiment is a multi-domain arrangement method S10" of multiple light-emitting diode chips under a single lens, which includes the following steps: setting a fourth color chip S17; setting a fourth concentric circle S18; and arranging plural numbers A second color chip and a plurality of third color chips S19.

[0114] Set a fourth color ...

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Abstract

The invention relates to a polydomain array method of multiple light-emitting diode chips under a single lens, comprising the following steps: setting a first concentric circle; and arraying at leastone first chip, one second chip and one third chip. The first concentric circle is formed on the bottom side of a semispherical lens by taking a lens axis of the semispherical lens as the center of circle, and chips with various colors are sequentially arrayed on the first concentric circle in an equal interval mode, thus the chips with various colors can be in a symmetrical light shape under thesemispherical lens and a light field with even mixed light can be further obtained. In addition, the polydomain array method of the multiple light-emitting diode chips under the single lens can ensurethat the multiple light-emitting diode chips form the densest array, thus the overall volume can be reduced.

Description

technical field [0001] The invention relates to a multi-domain arrangement method of multiple light-emitting diode chips under a single lens, in particular to a multi-domain arrangement method applied to color mixing of multiple light-emitting diode chips under a single lens. Background technique [0002] figure 1 It is one of the outgoing light patterns of the prior known hemispherical lens 10 . figure 2 It is the second light emitting pattern of the conventional hemispherical lens 10 . image 3 It is the outgoing light pattern diagram of the existing conventional planar lens. [0003] Such as figure 1 and figure 2 As shown, they are respectively the light-emitting mode 1 and mode 2 of the conventional hemispherical lens 10 . It is through two different viewing angles to measure the light pattern of the light emitting diode chips of each color passing through the hemispherical lens 10. From the measurement results, it can be found that due to the mirror axis 11 of th...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L25/075
Inventor 王志明何宜霖温士逸曾柏铭林钧闵
Owner HELIO OPTOELECTRONICS
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