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Glue overflow-preventing device and baseplate-laminating method using same

An anti-overflow adhesive and substrate technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of adhesive overflow on the substrate 50 and display panel 60, and achieve the effect of improving the overflow of adhesive

Active Publication Date: 2011-05-04
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the pressure is applied to the substrate 50, since the glue 70 will flow, it is easy to cause glue overflow around the substrate 50 and the display panel 60.

Method used

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  • Glue overflow-preventing device and baseplate-laminating method using same
  • Glue overflow-preventing device and baseplate-laminating method using same
  • Glue overflow-preventing device and baseplate-laminating method using same

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Embodiment Construction

[0035] figure 2 It is a schematic diagram of an anti-overflow glue device according to an embodiment of the present invention. Please refer to figure 2 , the anti-overflow glue device 100 of this embodiment includes a frame body 110 and at least one glue curing part 120 , and in this embodiment, a plurality of glue curing parts 120 are taken as an example. The frame body 110 has a side wall 112 arranged along a closed track 102 , and in this embodiment, the closed track 102 is, for example, a rectangular closed track. In addition, the sidewall 112 has at least one notch 113 , and one notch 113 is taken as an example in this embodiment. In addition, the glue curing member 120 is disposed on the outer surface 114 of the side wall 112 .

[0036] In the above-mentioned anti-overflow glue device 100, the material of the side wall 112 is, for example, a transparent material, such as polymethyl methacrylate, polycarbonate or a combination thereof, but is not limited thereto. Th...

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PUM

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Abstract

The invention relates to a glue overflow-preventing device, comprising a frame body and at least one glue-solidifying member, wherein the frame body is provided with a side wall arranged along a closed trajectory, and the side wall is provided with at least one notch. The glue-solidifying member is arranged on the external surface of the side wall. The glue overflow-preventing device can improve the condition of glue overflow. Besides, the invention also provides a baseplate-laminating method using the glue overflow-preventing device.

Description

technical field [0001] The invention relates to an anti-overflow glue device, and in particular to an anti-overflow glue device used in a substrate bonding process and a substrate bonding method using the anti-overflow glue device. Background technique [0002] In recent years, with the advancement of flat panel display technology and the advantages of light weight, thin thickness and power saving of flat panel displays, flat panel displays have gradually replaced traditional cathode ray tube (CRT) displays. Currently common flat panel displays include liquid crystal displays (liquid crystal displays, LCDs), plasma displays (plasma display panels, PDPs), electrophoretic displays (electrophoretic displays, EPDs) and the like. The display panel of these flat-panel displays can be coated with a substrate, and the substrate can be a protective plate or an optical plate that can provide a stereoscopic display function, such as a lenticular lens plate. [0003] figure 1 It is a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56
Inventor 李达汉
Owner AU OPTRONICS CORP
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