30results about How to "Prevent glue overflow" patented technology

The present invention provides a display panel and a package method thereof, and relates to the technical field of package. The method comprises the steps of: forming a frame-type box sealing glue ona cover plate substrate; forming filling glue on the cover plate substrate encircled by the box sealing glue; performing solidification of a mask to perform pre-solidification processing of the box sealing glue and obtain a package cover plate; laminating the display substrate and the package cover plate; performing secondary solidification processing of the box sealing glue; and performing presetsolidification processing for the filling glue to complete package. In the embodiment of the invention, the mask is solidified to separately perform pre-solidification processing for the box sealingglue, and at the same time, the filling glue cannot be subjected to pre-solidification processing to separately increase the solidification degree of the box sealing glue and improve the liquidity ofthe filling glue in the follow-up craft process so as to avoid the phenomenon that the box sealing glue can be collapsed by the filling glue and the filling glue is filled when the panel is laminated.

The invention relates to the technical field of printed circuit boards, in particular to a strippable blue glue plug hole jig and a method for stripping blue glue plug hole. A compressed air box and an air guide plate are arranged, and compressed air is input into the compressed air box, so that air with certain pressure is output from the compressed air box and is led into a through hole of a PCBproduction board through an air guide through hole of the air guide plate; and when the strippable blue glue is subjected to silk-screen printing, the strippable blue glue flowing to a hole in the bottom of the through hole is subjected to upward resistance by compressed air, and the strippable blue glue can be prevented from flowing out of the through hole through balance of gravity and resistance. Meanwhile, an air guide mesh base plate stacked between the air guide plate and the compressed air box is arranged, the air flow which enters the air guide plate can be balanced and stabilized through the air guide mesh base plate, so that the air flow which finally enters each through hole of the PCB production plate is stable, and the surface of the strippable blue glue which is plugged at the hole opening of the through hole is flat.

The invention relates to a camera module, which comprises an optical lens, a lens stand and a base, wherein the lens stand is used for bearing the optical lens; and the base is used for fixedly bearing the lens stand, the base has a length of 8 mm, a width of 8 mm and a height of 1 mm; and an annular boss is arranged on the base. The camera module has a reasonable structure, glue overflow can be prevented, the bonding strength is high, and the structure is stable and firm.

The invention discloses a full fitting tool and a full fitting method of a curved surface screen and a planar liquid crystal module, and belongs to the technical field of full fitting of display screens. The full fitting tool of the curved surface screen and the planar liquid crystal module comprises a positioning glue injection frame component, a first side of the positioning glue injection framecomponent is configured to be fitted with the curved surface screen, a second side of the positioning glue injection frame component is configured to fix the planar liquid crystal module, a glue injection space is formed between the curved surface screen and the planar liquid crystal module in the positioning glue injection frame component, at least one glue injection opening is further disposedon the positioning glue injection frame component, and the glue injection opening communicates with the glue injection space. In the full fitting method of the curved surface screen and the planar liquid crystal module, the above full fitting tool of the curved surface screen and the planar liquid crystal module is adopted. Prior to a glue injection procedure, the planar liquid crystal module is fixed at first, that is, a flow space of liquid optical glue is limited before the glue injection to prevent the overflow or lack of glue.

The invention provides a curing lamp which comprises a light source and a lampshade, wherein the lampshade is composed of a bottom reflecting surface and edge reflecting surfaces; the bottom reflecting surface is arranged on one side, away from an illuminated object, of the light source and is a hemispherical curved surface; and the edge reflecting surfaces are arranged surrounding the periphery of one side, facing the illuminated object, of the light source and are connected with the bottom reflecting surface. According to the curing lamp provided by the invention, lights can bypass an obstacle formed by slight deformation of a display device so as to prevent glue from overflowing, the strength of the lights can also be improved, the scattering angle of the lights can be increased, and the uniformity of lights emitted from different angles can be improved, thus the curing effect can be improved.

The invention relates to the field of adhesives, in particular to a high-temperature-resistant flexible single-component epoxy sealing adhesive and a preparation method thereof. The high-temperature-resistant flexible single-component epoxy sealing adhesive is prepared from the following raw materials in parts by weight: 10-40 parts of epoxy resin, 10-30 parts of a mixed softening resin, 5-20 parts of an active diluent, 5-20 parts of a mixed curing agent, 0.01-1 part of a polymerization inhibitor, 0.1-5 parts of fumed silica, 0.01-1 part of an infiltration flow promoter and 5-30 parts of spherical silica powder, the mixed curing agent is a mixture of a modified amine latent heat curing agent and a modified imidazole latent heat curing agent, and the mixed softening resin is prepared from at least two of F100, F300, Capa3050, H2004, HEF750, HEF751, EP-4000L and EP-4000S. The adhesive disclosed by the invention can be widely applied to sealing processes of USB ports and high-temperature-resistant reflow soldering processes, has good bonding performance on PA46, stainless steel, PC and the like, and ensures excellent waterproof sealing performance and plugging resistance of the USB ports of electronic products.

The invention discloses a plate-to-plate male connector in a strong lock structure. The male connector comprises fixing pins, a plastic body and a conductive terminal, and the fixing pins, the plasticbody and the conductive terminal are assembled together. The conductive terminal is in an inverted N-shaped structure, and the surface of the conductive terminal is provided with a plurality of concave structures in equilateral triangle distribution. The concave structures in the surface of the conductive terminal contact with female connector conducive terminal contact points which are enabled to fall into male conductive terminal grooves, and each contact of the conductive terminal is fixed, so that problems of separating and turning after insertion of male and female connectors are avoided. A glue sink structure surrounds the plastic body and the conductive terminal to prevent glue overflowing caused by an injection molding process. Left and right sides of the plastic body are providedwith projections respectively, one end is provided with a smooth arc surface for smooth transition joint with the lateral side, a guide effect is achieved in butt joint of the male and female connectors, and easiness in pulling is achieved in separation of the male and female connectors. The projections are small in female connector body inner groove contact area, a large space is reserved by twosides of each projection and a female connector body, and a fulcrum effect in pulling up is achieved.

The invention discloses an automatic component glue filling device of an LED driver, and aims to solve the technical problem that in the prior art, a finished product of the LED driver is prone to generate excessive glue, excessive glue or insufficient glue. The automatic component glue filling device comprises a workbench, wherein an indexing rotary disc is arranged on the workbench; a glue filling station, a feeding station and a discharging station on the workbench are symmetrically arranged in the radial direction of the indexing rotary disc; a linear moving module is arranged on one side,close to the glue filling station, of the workbench; the linear moving module can move close to or away from the glue filling station under the driving of a power module; a vibration module and a clamping module are arranged on the linear moving module; when the indexing rotary disc drives the LED driver to rotate from the feeding station and the discharging station to the glue filling station under the driving of the power module, the clamping module is driven by the linear moving module to be close to the LED driver, and a liquid level detector arranged on the side face of the glue fillingstation monitors the liquid level of a glue filling opening of the LED driver while the glue filling module arranged above the workbench is used for filling glue to the LED driver.

The invention discloses a manufacturing method of an efficient heat dissipation PCB. The method comprises the following steps of: configuring a first substrate, and carrying out first initial machining on the first substrate, and obtaining a first initial substrate; performing first glue overflow prevention treatment on the first initial substrate to obtain a first substrate to be pressed; configuring a second substrate, and performing first initial machining on the second substrate to obtain a second initial substrate; and performing second glue overflow prevention treatment on the second initial substrate to obtain a second substrate to be pressed. configuring a prepreg, and performing first process treatment on the prepreg to obtain a prepreg to be pressed; and configuring a first outer laminated board and a second outer laminated board, and performing second process treatment on the first substrate to be pressed, the second substrate to be pressed and the prepreg to be pressed based on the first outer laminated board and the second outer laminated board to obtain the efficient heat dissipation PCB, According to the manufacturing method, the PCB with a heat dissipation function can be manufactured, and it can be ensured that the manufactured PCB has good smoothness, andmeets the high-efficiency heat dissipation requirement.