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High-temperature-resistant flexible single-component epoxy sealing adhesive and preparation method thereof

An epoxy sealing, high temperature flexible technology, applied in the direction of epoxy resin glue, adhesive, adhesive additives, etc., can solve the problems of low bonding strength and low yield of silica gel, and achieve excellent waterproof sealing and plug resistance , High bonding strength, high bonding performance effect

Active Publication Date: 2020-05-08
COLLTECH DONGGUAN BONDING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most commonly used USB ports on the market are sealed and waterproofed with addition-type silica gel or epoxy adhesives with high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE). Although the addition type can meet the process of high-temperature reflow soldering requirements, but the bonding strength of silica gel is extremely low, and usually can only reach a thrust of about 120N; while high Tg, low CTE epoxy adhesives can meet the requirements, but the yield rate is not high when reflowing at high temperature

Method used

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  • High-temperature-resistant flexible single-component epoxy sealing adhesive and preparation method thereof
  • High-temperature-resistant flexible single-component epoxy sealing adhesive and preparation method thereof
  • High-temperature-resistant flexible single-component epoxy sealing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] A high-temperature-resistant flexible one-component epoxy sealing adhesive prepared from the following raw materials in parts by weight:

[0073] Epoxy resin: 20 parts of bisphenol F epoxy resin YLE1300F;

[0074] Softening resin: HEF750 26 parts;

[0075] Softening resin: 4 parts of H2004;

[0076] Reactive diluent: 20 parts of tertiary carbonic acid glycidyl ether E10P;

[0077] Curing agent: 2.6 parts of modified imidazole latent thermal curing agent PN-23;

[0078] Curing agent: modified amine latent thermal curing agent EH-4360S 7 parts;

[0079] Inhibitor: 0.1 part of 2,6-di-tert-butyl-p-cresol BHT;

[0080] Fumed silica: 5 parts of R8200;

[0081] Wetting flow promoter: MEGAFACE F-560 0.3 parts;

[0082] Spherical silica powder: 15 parts of Q010.

[0083] The preparation method of adhesive in the present embodiment comprises the following steps:

[0084] 1) Add epoxy resin, mixed softening resin, fumed silica, and spherical silicon micropowder into the st...

Embodiment 2

[0089] A high temperature resistant flexible one-component epoxy sealing adhesive prepared from the following raw materials in parts by weight: epoxy resin: 20 parts of bisphenol F epoxy resin YLE1300F;

[0090] Softening resin: 22 parts of HEF750;

[0091] Softening resin: 8 parts of H2004;

[0092] Reactive diluent: 20 parts of tertiary carbonic acid glycidyl ether E10P;

[0093] Curing agent: 2.6 parts of modified imidazole latent thermal curing agent PN-23;

[0094] Curing agent: modified amine latent thermal curing agent EH-4360S 7 parts;

[0095] Inhibitor: 0.1 part of 2,6-di-tert-butyl-p-cresol BHT;

[0096] Fumed silica: 5 parts of R8200;

[0097] Wetting flow promoter: MEGAFACE F-560 0.3 parts;

[0098] Spherical silica powder: 15 parts of Q010.

[0099] The preparation method of the adhesive in this example is consistent with Example 1.

Embodiment 3

[0101] A high temperature resistant flexible one-component epoxy sealing adhesive prepared from the following raw materials in parts by weight: epoxy resin: 20 parts of bisphenol F epoxy resin YLE1300F;

[0102] Softening resin: HEF750 18 parts;

[0103] Softening resin: 12 parts of H2004;

[0104] Reactive diluent: 20 parts of tertiary carbonic acid glycidyl ether E10P;

[0105] Curing agent: 2.6 parts of modified imidazole latent thermal curing agent PN-23;

[0106] Curing agent: modified amine latent thermal curing agent EH-4360S 7 parts;

[0107] Inhibitor: 0.1 part of 2,6-di-tert-butyl-p-cresol BHT;

[0108] Fumed silica: 5 parts of R8200;

[0109] Wetting flow promoter: MEGAFACE F-560 0.3 parts;

[0110] Spherical silica powder: 15 parts of Q010.

[0111] The preparation method of the adhesive in this example is consistent with Example 1.

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Abstract

The invention relates to the field of adhesives, in particular to a high-temperature-resistant flexible single-component epoxy sealing adhesive and a preparation method thereof. The high-temperature-resistant flexible single-component epoxy sealing adhesive is prepared from the following raw materials in parts by weight: 10-40 parts of epoxy resin, 10-30 parts of a mixed softening resin, 5-20 parts of an active diluent, 5-20 parts of a mixed curing agent, 0.01-1 part of a polymerization inhibitor, 0.1-5 parts of fumed silica, 0.01-1 part of an infiltration flow promoter and 5-30 parts of spherical silica powder, the mixed curing agent is a mixture of a modified amine latent heat curing agent and a modified imidazole latent heat curing agent, and the mixed softening resin is prepared from at least two of F100, F300, Capa3050, H2004, HEF750, HEF751, EP-4000L and EP-4000S. The adhesive disclosed by the invention can be widely applied to sealing processes of USB ports and high-temperature-resistant reflow soldering processes, has good bonding performance on PA46, stainless steel, PC and the like, and ensures excellent waterproof sealing performance and plugging resistance of the USB ports of electronic products.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a high-temperature-resistant flexible one-component epoxy sealing adhesive and a preparation method thereof. Background technique [0002] With the increasing emphasis on environmental protection and the development of electronic components in the direction of high density and miniaturization, the requirements for the performance of electronic packaging materials are also getting higher and higher. The rapid development of mobile Internet technology has enabled China to quickly enter the Internet era, and people's needs in various aspects such as food, clothing, housing, and transportation can be met through the Internet platform. The basis for realizing the mobile Internet society is ubiquitous electronic devices. These devices include mobile phones, notebook computers, tablet computers, and vehicle-mounted systems, etc. The development of portable and easy-to-carry electronic devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08C08G59/50
CPCC08G59/50C08G59/5073C08L2201/08C08L2203/20C08L2205/025C08L2205/03C09J11/04C09J11/08C09J163/00C08L101/00C08K7/26C08K7/18
Inventor 韩火年黄成生
Owner COLLTECH DONGGUAN BONDING TECH CO LTD
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