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A display panel and packaging method thereof

A technology of display panel and packaging method, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of short pre-curing time of sealing glue, collapse of sealing glue, overflow of filling glue, etc., so as to prevent the overflow of filling glue. Glue, prevent the filler from collapsing, and enhance the effect of curing

Active Publication Date: 2021-11-05
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] The present invention provides a display panel and its packaging method to solve the problem that in the current Dam&Filler packaging technology, the pre-curing time of the sealing glue is short, and the filling glue is pre-cured at the same time, so when the panels are pressed together, the sealing glue is very likely to be damaged. Filler collapsing and filling glue overflow phenomenon, which leads to packaging failure

Method used

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  • A display panel and packaging method thereof
  • A display panel and packaging method thereof
  • A display panel and packaging method thereof

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Embodiment 1

[0038] refer to figure 1 , shows a flow chart of steps of a display panel packaging method according to Embodiment 1 of the present invention.

[0039] The display panel packaging method of the embodiment of the present invention includes the following steps:

[0040] Step 101: forming a frame-shaped sealant on the cover substrate.

[0041] In the embodiment of the present invention, figure 2 It shows a schematic cross-sectional view of a packaging cover after forming a frame sealant, as shown in figure 2 As shown, first a cover substrate 10 may be provided, usually a glass substrate, and then a frame-shaped sealant 20 is formed on the cover substrate 10 . image 3 It shows a top view of the packaging cover plate after the frame sealant is formed, refer to image 3 The cover substrate area surrounded by the sealant 20 corresponds to the AA area (Active Area, effective display area) 01 in the display panel.

[0042] In a preferred embodiment, the material of the frame se...

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Abstract

The invention provides a display panel and a packaging method thereof, and relates to the technical field of packaging. Wherein, the method includes: forming a frame-shaped sealant on a cover substrate; forming a filler on the cover substrate surrounded by the sealant; Perform pre-curing treatment to obtain a package cover plate; press the display substrate and the package cover plate; perform secondary curing treatment on the frame sealing glue; perform a preset curing treatment on the filling glue to complete the packaging. In the embodiment of the present invention, the frame sealant can be pre-cured separately by curing the mask, while the filler glue is not pre-cured at the same time. Therefore, the curing degree of the frame sealant can be individually enhanced, and the The fluidity of the filling glue in the subsequent process can prevent the sealant from being washed away by the filling glue and the phenomenon of the filling glue overflowing when the panels are pressed together.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a display panel and a packaging method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) devices have been widely used in the field of display technology due to their advantages such as self-illumination, high contrast, thin thickness, wide viewing angle, low power consumption, and fast response. [0003] With the development and mass production of OLED devices, the corresponding packaging technology has also developed. In practical applications, top-emitting OLED display panels can usually be packaged with Dam&Filler (sealant and filler) packaging technology. [0004] However, in the current Dam&Filler packaging technology, while pre-curing the frame sealant with ultraviolet light, the filler will also be pre-cured for the same length of time. In order to ensure the fluidity of the filler, the pre-cure The time is usually...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/84H10K71/00
Inventor 贾文斌高昕伟李朋孙力
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
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