Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate adhesion method

A substrate and bonding technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of glue overflow between the substrate 50 and the display panel 60, and achieve the effect of improving the glue overflow

Active Publication Date: 2012-07-25
AU OPTRONICS CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when the pressure is applied to the substrate 50, since the glue 70 will flow, it is easy to cause glue overflow around the substrate 50 and the display panel 60.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate adhesion method
  • Substrate adhesion method
  • Substrate adhesion method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] figure 2 It is a schematic diagram of an anti-overflow glue device according to an embodiment of the present invention. Please refer to figure 2 , the anti-overflow glue device 100 of this embodiment includes a frame body 110 and at least one glue curing part 120 , and in this embodiment, a plurality of glue curing parts 120 are taken as an example. The frame body 110 has a side wall 112 arranged along a closed track 102 , and in this embodiment, the closed track 102 is, for example, a rectangular closed track. In addition, the sidewall 112 has at least one notch 113 , and one notch 113 is taken as an example in this embodiment. In addition, the glue curing member 120 is disposed on the outer surface 114 of the side wall 112 .

[0035] In the above-mentioned anti-overflow glue device 100, the material of the side wall 112 is, for example, a transparent material, such as polymethyl methacrylate, polycarbonate or a combination thereof, but is not limited thereto. Th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a substrate adhesion method, which is applied to adhesion of two substrates. The substrate adhesion method comprises the following steps of: providing an adhesive-overflowing resistant device, wherein the adhesive-overflowing resistant device comprises a frame body and at least one colloid solidification piece, the frame body is provided with a sidewall which is arranged along a closed track, the sidewall is provided with at least one notch, and the colloid solidification piece is arranged on an outer surface of the sidewall; placing the substrates in the frame body and coating a colloid between the substrates; pressing the substrates; and solidifying the colloid by the at least one colloid solidification piece. In the adhesive-overflowing resistant device, the colloid can be overflowed only from the notch on the sidewall of the frame body, so that the situation of adhesive overflowing can be improved. Moreover, the colloid solidification piece which is arranged on the outer surface of the sidewall can solidify the colloid on edges of the substrates after the substrates are pressed, so that the situation of adhesive overflowing after the substrates are taken out can be prevented. Furthermore, the adhesive-overflowing resistant device is used in the substrate adhesion method, so that the situation of the adhesive overflowing can be improved.

Description

[0001] The present invention is a divisional application for the parent application (application number: 200910211893.3, invention name: anti-overflow glue device and substrate bonding method using the anti-overflow glue device). technical field [0002] The invention relates to an anti-overflow glue device, and in particular to an anti-overflow glue device used in a substrate bonding process and a substrate bonding method using the anti-overflow glue device. Background technique [0003] In recent years, with the advancement of flat panel display technology and the advantages of light weight, thin thickness and power saving of flat panel displays, flat panel displays have gradually replaced traditional cathode ray tube (CRT) displays. Currently common flat panel displays include liquid crystal displays (liquid crystal displays, LCDs), plasma displays (plasma display panels, PDPs), electrophoretic displays (electrophoretic displays, EPDs) and the like. The display panel of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56
Inventor 李达汉
Owner AU OPTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com