Substrate adhesion method

A substrate and bonding technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of glue overflow between the substrate 50 and the display panel 60, and achieve the effect of improving the glue overflow
CN102148170BActive Publication Date: 2012-07-25AU OPTRONICS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AU OPTRONICS CORP
Publication Date
2012-07-25

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Abstract

The invention discloses a substrate adhesion method, which is applied to adhesion of two substrates. The substrate adhesion method comprises the following steps of: providing an adhesive-overflowing resistant device, wherein the adhesive-overflowing resistant device comprises a frame body and at least one colloid solidification piece, the frame body is provided with a sidewall which is arranged along a closed track, the sidewall is provided with at least one notch, and the colloid solidification piece is arranged on an outer surface of the sidewall; placing the substrates in the frame body and coating a colloid between the substrates; pressing the substrates; and solidifying the colloid by the at least one colloid solidification piece. In the adhesive-overflowing resistant device, the colloid can be overflowed only from the notch on the sidewall of the frame body, so that the situation of adhesive overflowing can be improved. Moreover, the colloid solidification piece which is arranged on the outer surface of the sidewall can solidify the colloid on edges of the substrates after the substrates are pressed, so that the situation of adhesive overflowing after the substrates are taken out can be prevented. Furthermore, the adhesive-overflowing resistant device is used in the substrate adhesion method, so that the situation of the adhesive overflowing can be improved.
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Description

[0001] The present invention is a divisional application for the parent application (application number: 200910211893.3, invention name: anti-overflow glue device and substrate bonding method using the anti-overflow glue device). technical field

[0002] The invention relates to an anti-overflow glue device, and in particular to an anti-overflow glue device used in a substrate bonding process and a substrate bonding method using the anti-overflow glue device. Background technique

[0003] In recent years, with the advancement of flat panel display technology and the advantages of light weight, thin thickness and power saving of flat panel displays, flat panel displays have gradually replaced traditional cathode ray tube (CRT) displays. Currently common flat panel displays include liquid crystal displays (liquid crystal displays, LCDs), plasma displays (plasma display panels, PDPs), electrophoretic displays (electrophoretic displays, EPDs) and the like. The display panel of t...

Claims

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