Method for laminating cover film in flexible board

A cover film and middle layer technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of glue overflow, achieve the effect of strengthening, preventing glue overflow, and saving materials

Active Publication Date: 2016-11-02
JIANGNAN INST OF COMPUTING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The problem solved by the present invention is to provide a method for laminating cover films in soft boards, which effectively solves the problem of glue overflow when laminating cover films in soft boards, and improves the signal transmission quality of formed PCB soft boards

Method used

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  • Method for laminating cover film in flexible board
  • Method for laminating cover film in flexible board
  • Method for laminating cover film in flexible board

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Experimental program
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Embodiment Construction

[0033] As described in the background technology, when using the prior art flexible board forming method to form a soft board whose window size of the cover film is smaller than the size of the pad, glue overflow when laminating the cover film and the flexible copper foil substrate The phenomenon is serious, which seriously affects the signal transmission of the subsequently formed PCB soft board.

[0034] After research, the inventors of the present invention have found that when using the prior art to form a common soft board, since the size of the window of the cover film is larger than the size of the pad, there is a gap between the cover film and the pad, and there is a gap between the layers. When the covering film is pressed, the part overflowing after the adhesive melts will first overflow into the gap, and will not overflow to the pad, which will affect the signal transmission of the subsequently formed PCB soft board. and please refer to figure 2 The surface of the...

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Abstract

The invention provides a method for laminating a cover film in a soft board. The method includes a first step of providing a soft copper clad substrate and the cover film, a welding disc is formed on the soft copper clad substrate, and a window is arranged on the cover film, a second step of enabling the cover film to be covered on the surface of the soft copper clad substrate, and enabling the welding disc to be exposed out of the window, a third step of forming a glue blocking layer corresponding to the window after the cover film is covered on the surface of the soft copper clad substrate, and a fourth step of laminating the soft copper clad substrate and the cover film after the glue blocking layer is formed. The glue blocking layer has good elastic deformation capacity under a high temperature and high pressure environment, can fully fill the window in the laminating process, and avoids glue leakage, so the method improves signal transmission capacity of a follow-up formed printed circuit board (PCB) soft board.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for laminating a cover film in a soft board. Background technique [0002] PCB soft board, that is, flexible printed circuit board (Flexible Printed Circuit), compared with rigid circuit boards, soft board material characteristics are flexible, and has the advantages of easy bending, light weight, thin thickness, etc., so it is often used in needs Products with thin and light design or movable mechanism design, such as mobile phones, notebook computers, monitors, consumer electronics products, touch panels and IC packaging, etc. [0003] Please refer to figure 1 , a method for forming a soft board in the prior art, comprising: [0004] A flexible copper foil substrate (not shown) is provided, and the flexible copper foil substrate includes a flexible substrate 100 and pads 103 formed on the flexible substrate, circuits (not shown), etc., the pads 10...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 吴小龙吴梅珠刘秋华徐杰栋徐志周文木胡广群
Owner JIANGNAN INST OF COMPUTING TECH
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