Method for laminating cover film in flexible board

A cover film and middle layer technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of glue overflow, achieve the effect of strengthening, preventing glue overflow, and saving materials
CN103108502BActive Publication Date: 2016-11-02JIANGNAN INST OF COMPUTING TECH
2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGNAN INST OF COMPUTING TECH
Publication Date
2016-11-02

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides a method for laminating a cover film in a soft board. The method includes a first step of providing a soft copper clad substrate and the cover film, a welding disc is formed on the soft copper clad substrate, and a window is arranged on the cover film, a second step of enabling the cover film to be covered on the surface of the soft copper clad substrate, and enabling the welding disc to be exposed out of the window, a third step of forming a glue blocking layer corresponding to the window after the cover film is covered on the surface of the soft copper clad substrate, and a fourth step of laminating the soft copper clad substrate and the cover film after the glue blocking layer is formed. The glue blocking layer has good elastic deformation capacity under a high temperature and high pressure environment, can fully fill the window in the laminating process, and avoids glue leakage, so the method improves signal transmission capacity of a follow-up formed printed circuit board (PCB) soft board.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for laminating a cover film in a soft board. Background technique

[0002] PCB soft board, that is, flexible printed circuit board (Flexible Printed Circuit), compared with rigid circuit boards, soft board material characteristics are flexible, and has the advantages of easy bending, light weight, thin thickness, etc., so it is often used in needs Products with thin and light design or movable mechanism design, such as mobile phones, notebook computers, monitors, consumer electronics products, touch panels and IC packaging, etc.

[0003] Please refer to figure 1 , a method for forming a soft board in the prior art, comprising:

[0004] A flexible copper foil substrate (not shown) is provided, and the flexible copper foil substrate includes a flexible substrate 100 and pads 103 formed on the flexible substrate, circuits (not shown), etc., the pads 10...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More