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Wire, preparing method and application thereof

A technology of wires and inner wires, which is applied in the field of wires, can solve the problems of restricting earphone signal wires, earphones cannot be used continuously, and low flexibility, etc., and achieves easy large-scale industrial production, excellent transmission performance and durability, and simple operation Effect

Inactive Publication Date: 2015-04-22
J NOVA WORKS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low flexibility of the above-mentioned high-conductivity metal material, during use, due to external pulling force or its own gravity, and repeated winding, the wire wrapped in the sheath will break, resulting in the earphone not being able to continue to use
However, except for the earphone cable, the plug and the speaker are all good. If the earphone is damaged only because of the insufficient bending resistance of the earphone cable and the earphone is thrown away, it will cause a lot of waste and is not conducive to environmental protection.
[0003] At the same time, with the development of the current electronic equipment in the direction of portability, the headphone wires are also becoming lighter and thinner; and the current metal used as a wire directly restricts the development of the earphone signal wires to be lighter due to its own quality characteristics. process

Method used

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  • Wire, preparing method and application thereof
  • Wire, preparing method and application thereof

Examples

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Effect test

Embodiment 1

[0033] The wires of this embodiment, such as figure 1 As shown, it includes an insulating protective layer 1 and an inner wire located in the insulating protective layer 1. The inner wire includes at least one conductive unit, and each conductive unit includes a non-metallic fiber core wire 3 and is covered outside the non-metallic fiber core wire 3. The conductive layer 2.

[0034] Among them, the non-metallic fiber core wire 3 is a carbon nanotube fiber core wire composed of carbon nanotube fibers, and the diameter of each carbon nanotube fiber core wire is 100 μm; the conductive layer 2 is specifically a copper-plated layer, and its thickness is 20 μm ; The insulating protective layer 1 is a polyimide insulating protective layer 1 .

[0035] The inner wire of this embodiment is formed by intertwining 10 conductive units in order to enhance its signal transmission capability.

[0036] The preparation method of the wire of the present embodiment comprises the following step...

Embodiment 2

[0044] The wire of this embodiment differs from that of Embodiment 1 in that the insulating protective layer is a multilayer structure, such as figure 2 As shown, it includes a conductor shielding layer 7, an insulating layer 6, an insulating shielding layer 5 and an outer protective layer 4 in order from inside to outside.

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Abstract

The invention discloses a wire, and further discloses a preparing method of the wire and an application thereof. The wire comprises an insulation protecting layer and inner wires located in the insulation protecting layer. Each inner wire comprises at least one conducting element. Each conductive element comprises nonmetal fiber core wires, and a conducting layer arranged on the outside of the nonmetal fiber core wires. Due to the fact that the conducting layer is arranged on the surfaces of the nonmetal fiber core wires, the wire has the advantages of being simple in operation and easy in wide range industrial production The surface of the wire manufactured with the method is even. By further twisting and twining the multiple conducting elements, the structure is more compact, and the electrical performance and the mechanical performance can be further improved.

Description

technical field [0001] The invention relates to a wire, and also relates to a preparation method and application of the wire. Background technique [0002] With the rapid development of science and technology and social economy, and the continuous improvement of the industrial level, consumers have higher and higher requirements for the quality, performance and safety of earphone products. Existing earphone wires are basically made of high-conductivity metal materials such as copper, aluminum or silver. Due to the low flexibility of the above-mentioned high-conductivity metal material, during use, due to external pulling force or its own gravity, and repeated winding, the wire wrapped in the sheath will break, resulting in the earphone not being able to continue to use. But in addition to the earphone cable, the plug and the speaker are all good. If the earphone is damaged only because of the insufficient bending resistance of the earphone cable and the earphone is thrown ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B7/00H01B13/00
Inventor 王有富朱木兰葛英黄哲军
Owner J NOVA WORKS CO LTD
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