Structure for packaging organic electroluminescence device

Abstract

Encapsulation structure for organic electroluminescence device (OELD) includes following parts and structures: base plate and OELD on the base plate; encapsulation cover plate above the base plate in use for covering the OELD; multiple partition walls are setup at glue spreading region; A sealing glue regions are formed between two adjacent partition walls naturally. Agglutination glue is accommodated inside sealing glue regions. Thus, encapsulation cover plate through agglutination glue is agglutinated on the base plate. The invention raises superior rate and manufacturing efficiency and quality of product, as well as reduces glue flooding so as to be in favor of mass manufacture of the product.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a packaging structure of an organic electroluminescent device, which can not only prevent the glue overflow situation in the packaging process and protect the light-emitting elements in the packaging cover plate, but also prevent the adhesive glue from overflowing. Flow in the cutting channel and affect the subsequent cutting process. Background technique [0002] Compared with other light-emitting structures, organic electroluminescent devices have the advantages of self-luminescence, high brightness, wide viewing angle, low power consumption, high response speed, light and thin panel, simple component structure and manufacturing process, etc., so they are particularly popular among research institutes and manufacturers in various countries. attention. [0003] However, during the packaging process of the existing organic electroluminescence (OLED) device 10, such as Figure 1A ...

AI Technical Summary

Problems solved by technology

However, during the pressing process of the adhesive colloid 15, due to the pressing action of the external force F, the adhesive colloid 15 will inevitably be deformed to form an inner overflow glue 151 and an outer overflow glue 153.

[0005] Wherein, if the internal overflow glue 151 is in contact with the OLED element 13, it is more likely to cause the OLED element 13 to fail, thereby affecting the quality of the OLED device 10.

The external glue overflow 153 may overflow to the cutting line 115 outside the OLED device 10, thereby affecting the subsequent cutting steps of the OLED device 10.

[0006] In addition, the adhesive gel 15 does not have a clear placement position and installation height during the packaging process, which will increase the difficulty of manufacturing and is not conducive to mass production of products.

Images