High heat conduction and high power LED substrate

Abstract

The invention relates to a low thermal resistance and high power LED substrate which is designed special for mounting LEDs. The substrate comprises a metal bottom board, an insulating board and two copper-clad conducting layers arranged on both the upper surface and the lower surface of the insulating board, wherein the copper-clad conducting layer on the lower surface of the insulating board directly connects the insulating board with the metal bottom board through soldering tin. When in use, an LED pin is welded with the copper-clad conducting layer namely a circuit on the upper surface of the insulating board, and a raised part of the metal bottom board corresponding to an LED base passes through a window hole corresponding to the raised part on the insulating board on the raised part and is in direct contact with the heat sink of the LED base for quickly dissipating heat so as to overcome the technical bottleneck of difficult heat dissipation of the LEDs.

Description

technical field [0001] The invention relates to electronic equipment, in particular to a circuit board mounted with light-emitting diodes (LEDs). Background technique [0002] Semiconductor light-emitting diode LED is a new type of electric light source, and its basic working principle is to use solid semiconductor chips as light-emitting materials. When a voltage is applied to both ends, the interceptors in the semiconductor recombine to cause photon emission to generate light. The emitted light is non-radiative light, pure light color, concentrated beam, high color rendering index, and good temperature characteristics. It has the advantages of low power consumption, stable performance, long life, no pollution, and simple use. At present, it has been widely used for lighting and decoration. For example, the Water Cube, the Beijing Olympic venue, has installed 100,000 lights and 300,000 points, which can change 16 million kinds of LED colors. However, there is an important...

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Problems solved by technology

Since the thermal conductivity of the insulating layer is only one-tenth of that of metal, the thermal conductivity is very poor, which makes it difficult for the heat generated by the LED to dissipate. Measures must be taken to strengthen the heat dissipation. This is especially serious for occasions where a large number of LEDs are used intensively. Technical bottleneck of LED lighting project

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