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A machining device

A technology for processing devices and objects to be processed, applied in metal processing equipment, metal processing mechanical parts, manufacturing tools, etc., and can solve the problems of inability to detect alignment patterns or spacers, and inability to perform alignment.

Active Publication Date: 2013-06-19
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, in the case of processing a workpiece having an opaque layer such as a metal layer on the alignment pattern layer, or processing a workpiece having a metal layer on the back surface from the back, even if using The IR camera shoots from the side of the metal layer, and cannot detect the alignment pattern or spacer, and the alignment cannot be performed

Method used

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Experimental program
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Embodiment Construction

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 A schematic configuration diagram showing a laser processing apparatus including an imaging unit (first imaging unit) of the present invention that captures a wafer from below the card table (holding table).

[0038] The laser processing device 2 includes a first slider 6 mounted on a stationary base 4 so as to be movable in the X-axis direction. The first slider 6 moves in the X-axis direction along a pair of guide rails 14 by an X-axis feed unit 12 composed of a ball screw 8 and a pulse motor 10 .

[0039] A support box 16 is mounted on the first slider 6 so as to be movable in the Y-axis direction. The support box 16 is moved in the Y-axis direction along a pair of guide rails 24 by a Y-axis feed unit (index feed unit) 22 constituted by a ball screw 18 and a pulse motor 20 .

[0040] A card table 28 is rotatably mounted on the support box 16 . Suc...

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PUM

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Abstract

The present invention provides a processing device capable of photographing an object to be photographed when there is a processed object of opaque layer existed between the processing mechanism and the object to be photographed in photographing. The processing device of the present invention has a base and is characterized in comprising: a holding platform having a holding pad formed by a transparent material for holding the processed object; a processing mechanism for processing the processed object held in the holding platform; a processing transfer mechanism for relatively transferring the holding platform and the processing mechanism in the X-axis direction parallel to the surface of the holding platform and in the Y-axis direction perpendicular to the X-axis direction; and a photographing mechanism installed in the base for taking a picture of the processed object held in the holding platform via the transparent holding pad, and disposed below the holding pad. When taking a picture of the processed object, the holding platform moves over the photographing mechanism via the processing transfer mechanism.

Description

technical field [0001] The present invention relates to a processing device for processing a semiconductor wafer, in particular to a mechanism for aligning an imaging unit of the processing device. Background technique [0002] In the semiconductor device manufacturing process, individual semiconductor chips are manufactured by cutting a semiconductor wafer on the surface of a substantially disc-shaped semiconductor wafer along a street (street, planned cutting line) to divide into each device. The upper part is divided into a plurality of regions by spacer lanes arranged in a grid pattern, and devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed on each of the divided regions. [0003] Slicing of the semiconductor wafer along the lanes is usually performed by a cutting device known as a slicer. In addition to the dicing method using a cutting device, a laser dicing method using a pulsed laser light having a wavelength that is transparent to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/68B23K26/00B23K26/02B23Q17/24B24B49/12
Inventor 福冈武臣大宫直树增田幸容秋田壮一郎高桥聪成田亮治
Owner DISCO CORP