Functional electroplating process of copperplates of crystallizers

A technology of mold copper plate and electroplating process, which is applied in the field of chemical engineering, can solve the problems of affecting the amount of steel passing through the copper plate, affecting the production efficiency of a continuous casting machine, and accumulating internal stress of the coating, so as to shorten the electroplating production cycle and omit sandblasting. Process, the effect of reducing the probability of peeling off the coating

Inactive Publication Date: 2011-09-07
ANSTEEL HEAVY MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of continuous casting technology, copper plate electroplating technology develops rapidly: the coating material develops from simple metal to alloy material, from chromium to nickel to nickel-iron, nickel-cobalt alloy, and the coating form develops from composite layer to single layer. This functional electroplating Different from ordinary electroplating, the coating is relatively thick, usually with a thickness of 0.2mm-2mm, which inevitably leads to a large accumulation of internal stress in the coating. In the continuous casting production of copper plates, the coating working surface is in the environment of high-temperature molten steel and cooling water. Frequent alternation can induce cracks in the coating, and sometimes the coating will fall off, which affects the amount of steel passed through the copper plate and affects the production efficiency of the continuous casting machine
Moreover, there are many electroplating processes and the production cycle is long

Method used

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  • Functional electroplating process of copperplates of crystallizers
  • Functional electroplating process of copperplates of crystallizers
  • Functional electroplating process of copperplates of crystallizers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 1. Process flow:

[0019] Chemical degreasing→insulation→electrodegreasing→concentrated acid leaching→electroplating into the tank→out of the tank

[0020] 2. The composition of the sulfate bath is:

[0021]

[0022] Additive A1, 30ml / l, additive A1 is an aqueous solution of sodium benzenesulfinate and saccharin, wherein the mass percent of sodium benzenesulfinate is 10%, the mass percent of saccharin is 30%, and the rest is water;

[0023] Additive A2: 80ml / l, the additive A2 is an aqueous solution of butynediol, and the mass percentage of butynediol is 32%.

[0024] The plating parameters are:

[0025] Temperature: 35-70°C Cathode area: Anode area = 1:2

[0026] pH value: 1.5-5.0 Current density: 1.0-5.0 A / dm 2 .

Embodiment 2

[0028] The composition of sulfate bath is:

[0029]

[0030] Additive A1, 20ml / l, additive A1 is an aqueous solution of sodium benzenesulfinate and saccharin, wherein the mass percent of sodium benzenesulfinate is 20%, the mass percent of saccharin is 35%, and the rest is water;

[0031] Additive A2: 70ml / l, the additive A2 is an aqueous solution of butynediol, and the mass percentage of butynediol is 35%.

[0032] Process flow and electroplating parameters are the same as in Example 1.

Embodiment 3

[0034] The composition of sulfate bath is:

[0035]

[0036] Additive A1, 40ml / l, additive A1 is an aqueous solution of sodium benzene sulfinate and saccharin, wherein the mass percentage of sodium benzene sulfinate is 30%, the mass percentage of saccharin is 40%, and the rest is water;

[0037] Additive A2: 90ml / l, the additive A2 is an aqueous solution of butynediol, and the mass percentage of butynediol is 40%.

[0038] Process flow and electroplating parameters are the same as in Example 1.

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PUM

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Abstract

The invention relates to a functional electroplating process of copperplates of crystallizers of conticasters. The process is characterized by comprising the processes of chemical degreasing, insulating treatment, electrolytic degreasing, concentrated acid leaching eroding, rundowntank electroplating and out-tank; iron salt and cobalt salt are added to a sulfate plating solution main salt system at the same time; a combination additive is adopted; and the sand spraying process can be omitted in the plating pre-treatment so that the process is optimized. The invention has the advantages of small stress, less process, short manufacturing period and low cost.

Description

technical field [0001] The invention relates to the field of chemical engineering, in particular to a functional electroplating process for a mold copper plate of a continuous casting machine. Background technique [0002] The mold copper plate is an important part of the continuous casting machine. The molten steel flows through the mold of the continuous casting machine and is cooled to form a billet. In the continuous casting and drawing production process, the surface of the billet and the copper plate are in contact with each other to cause friction, and the surface of the copper plate is worn. Usually, a layer of material with good thermal conductivity and wear resistance is plated on the surface by functional electroplating technology to achieve lightening of the surface of the copper plate. The purpose of reducing wear, increasing the number of copper plate repairs, and prolonging the service life of the copper plate. With the development of continuous casting techn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/56B22D11/059
Inventor 戚克新孙凤国齐盛文王玲
Owner ANSTEEL HEAVY MACHINERY CO LTD
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