Unlock instant, AI-driven research and patent intelligence for your innovation.

Lead frame structure for packaging SOT26-3L

A lead frame and ground wire technology, which is applied in the field of semiconductor device packaging, can solve problems such as multi-power, product failure, and reduced product qualification rate.

Inactive Publication Date: 2010-06-30
WUXI RED MICROELECTRONICS CORP
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The power input pin 2 is connected to the bottom of the chip 5 through insulating glue, and a voltage of more than ten volts or tens of volts needs to be applied to the power input pin 2, because the dispensing process cannot guarantee the precise thickness of the insulating glue and its material in the insulating glue packaging process The inconsistency of the insulation strength, and the long working time of the finished product in the actual use process lead to a rise in temperature, causing the power input pin 2 to penetrate the insulating glue, causing the chip 5 to leak, and then causing the static leakage current to be too large or gradually increase , consume too much power, waste energy, and cause product failure, reducing the product qualification rate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead frame structure for packaging SOT26-3L
  • Lead frame structure for packaging SOT26-3L
  • Lead frame structure for packaging SOT26-3L

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0012] Specific embodiment one, see figure 2 , which includes a base island 1, a power input pin 2, an output pin 3, a ground pin 4, and a chip 5. After insulating glue (not shown in the figure, which belongs to the existing mature technology) on the surface of the base island 1, the insulating glue Place the chip 5, the upper surface of the chip 5 has an output pad 6, a ground pad 7, and an input pad 8, the power input pin 2 is directly connected to the input pad 8, and the power input pin 2 is directly connected to the input pad 8 by gold wire bonding; The ground pin 4 is connected to the base island 1, the ground pad 7 is connected to the base island 1 by gold wire bonding; the output pad 6 is connected to the output pin 3 by gold wire bonding.

specific Embodiment 2

[0013] Specific embodiment two, see image 3 , which includes a base island 1, a power input pin 2, an output pin 3, a ground pin 4, and a chip 5. After insulating glue (not shown in the figure, which belongs to the existing mature technology) on the surface of the base island 1, the insulating glue Place the chip 5, the upper surface of the chip 5 has an output pad 6, a ground pad 7, and an input pad 8, the power input pin 2 is directly connected to the input pad 8, and the power input pin 2 is directly connected to the input pad 8 by gold wire bonding; The ground pin 4 is connected to the base island 1, and the ground pad 7 is connected to the ground pin 4 by gold wire bonding; the output pad 6 is connected to the output pin 3 by gold wire bonding.

[0014] The specific Chinese explanation of SOT26-3L is as follows:

[0015] SOT: Small Outline Transistor;

[0016] SOT26 is a specific type of small outline transistor;

[0017] SOT26-3L is a SOT26 with three pins.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a lead frame structure for packaging SOT26-3L. The lead frame structure can not consume excessive electric energy or waste energy resources, improves the qualification rate of products and comprises a base land, a power supply input pin, an output pin, an earth wire pin and a chip, wherein after the insulating glue is applied to the surface of the base land, the chip is placed on the insulating glue; and the upper surface of the chip is provided with an output welding area, a grounded welding area and an input welding area. The lead frame structure is characterized in that the power supply input pin is directly connected with the input welding area.

Description

(1) Technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a lead frame structure of SOT26-3L packaging. (2) Background technology [0002] For the lead frame structure of the existing SOT26-3L package see figure 1 , which includes base island 1, power input pin 2, output pin 3, ground pin 4, and chip 5. Base island 1 is directly connected to power input pin 2. After insulating glue is placed on the surface of base island 1, the insulating glue is placed chip5. Chip output pad 6 gold wire bonding output pin 3, chip ground pad 7 gold wire bonding ground pin 4. Since the base island 1 is directly connected to the power supply input pin 2, the input pad 8 on the chip 5 can be bonded to any part of the base island 1 with gold wire. [0003] The power input pin 2 is connected to the bottom of the chip 5 through insulating glue, and a voltage of more than ten volts or tens of volts needs to be applied to the power...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/495
CPCH01L2224/48257H01L2224/45144H01L2224/48247
Inventor 侯友良
Owner WUXI RED MICROELECTRONICS CORP