Semiconductor Device Leadless Package Structure

Abstract

The invention discloses a leadless packaging structure of a semiconductor device, comprising a substrate and a circuit tube core, wherein the substrate at least comprises upper top metal, a middle dielectric layer and a lower bottom metal, wherein the bottom metal is used as the ground; the top metal comprises a circuit tube core pasting area bonded together with the circuit tube core through an adhesive; a raised first solder mask layer is arranged above the edge of the circuit tube core pasting area; the top metal is provided with a substrate grounding and bonding area electrically connected with the circuit tube core pasting area outside the circuit tube core pasting area, and the substrate grounding and bonding area is externally provided with a second solder mask layer; a circuit tube core bonding area on the circuit tube core is connected with the substrate grounding and bonding area through a grounding and bonding wire; the first solder mask layer limits the adhesive in an area within the substrate grounding and bonding area; and the circuit tube core pasting area on the substrate is connected with the bottom metal through a through hole and then grounded. The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.

Description

technical field [0001] The invention relates to a structure of a semiconductor device, in particular to a leadless packaging structure of a semiconductor device. Background technique [0002] The field of wireless communication is facing the challenges of improving product integration, reducing product size and reducing product cost. The requirements for smaller, more complex and faster products not only challenge the design of circuit dies, but also The fabrication of various package structures presents new challenges. [0003] Bonding wires are often used to form inductance in leadless packages. Bonding wires are very thin metal wires used to connect circuit dies and package pins. The circuit dies are circuit tubes fixed to the substrate by adhesives. core bonding area, and then use the bonding wire to electrically connect the circuit die bonding area to the substrate grounding bonding area. There are usually through holes near the substrate grounding bonding area to conn...

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Problems solved by technology

from figure 1 It can be seen from the figure that since the substrate ground bonding areas 105a, 105b are not adjacent to the circuit die bonding area 102, the ground bonding wires 106a, 106b are longer, because the performance of the power amplifier circuit die is more sensitive to the length of the bonding wire , lengthening the length of the bonding wires 106a, 106b between the connection circuit die bonding regions 107a, 107b and the substrate grounding bonding regions 105a, 105b will affect the overall performance of the device, increase the package size, increase the cost of the device, and ground at the same time The through holes 111a, 111b near the bonding areas 105a, 105b will also increase the package size and increase the equipment cost

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