Unlock instant, AI-driven research and patent intelligence for your innovation.

Acceleration sensor

An acceleration sensor, acceleration technology, applied in the direction of measurement of acceleration, multi-dimensional acceleration measurement, speed/acceleration/shock measurement, etc., can solve the problems of insufficient mitigation of external force, lack of symmetry, insufficient mitigation of external force, etc.

Inactive Publication Date: 2010-06-30
HITACHI METALS LTD
View PDF13 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since there are two beams, the center line of the support frame and the weight is not on the same line as the center line of the beam, lacking symmetry, and the relaxation of external force is not sufficient
In addition, although it is disclosed that the centerlines of the beams connected to the support frame and the centerlines of the beams connected with the weight are shifted, and the beams are used to connect them, the shape lacks symmetry with respect to the centerlines of the support frame and the weight. Sexual structure, so the relaxation of external force is not enough
In particular, in making Figure 18 In the acceleration sensor of the resin molded part as shown, it is difficult to reduce the sensitivity change due to the large external force applied.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Acceleration sensor
  • Acceleration sensor
  • Acceleration sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123] Next, the acceleration sensor according to Embodiment 1 of the present invention will be described. figure 1 and figure 2 The structure of the acceleration sensor element used for the acceleration sensor of Example 1 is shown. figure 1 is a plan view of the acceleration sensor 100a, figure 2 yes figure 1 Sectional view of line II-II. The accelerometer element can be suitable for example: such asFigure 15 The assembled acceleration sensor 200 shown in the exploded perspective view and the Figure 14 The illustrated cover is hermetically sealed and then assembled into the acceleration sensor 300 of the resin package. In particular, the present invention is characterized in the structure of the acceleration sensor element, and therefore the acceleration sensor element will be described in detail below.

[0124] In the acceleration sensor element 100 a , a weight 20 is provided at the center of a space 15 surrounded by the support frame 10 , and a notch 22 is form...

Embodiment 2

[0132] Next, an acceleration sensor according to Embodiment 2 of the present invention will be described. The difference from Embodiment 1 is that the stress buffering part is made into a labyrinth structure. Figure 6 The beam structure of Example 2 is shown in plan view. Like the beam, the stress buffer is formed in the first layer of the SOI wafer, and thus has the same thickness as the beam. The stress buffering portion 40' is made into a labyrinth structure connecting a plurality of straight sides at their ends to form a right angle, and is symmetrical about the center. That is, the stress buffer 40' is symmetrical about the intersection point p of the length centerline m-m' of the beam 30 and the width centerline n-n' of the beam 30.

[0133]refer to Figure 6 The labyrinth-shaped stress buffering portion 40' will be described in detail. The beam 30 connecting the support frame 10 and the weight 20 is composed of a stress buffer 40 ′ arranged in the center of the bea...

Embodiment 3

[0137] Next, an acceleration sensor according to Embodiment 3 of the present invention will be described. Figure 7 A shows the structure of the beam of Example 3 in plan view. Figure 7 The beam 30 of A has two stress buffering portions 40 ′ constituted by sides connected to form a labyrinth. Here, these two stress buffering portions 40 ′ are respectively referred to as a first stress buffering portion and a second stress buffering portion. The beam 30 is divided into a first part 32 of the beam that connects the weight to the first stress buffer, a second part 34 that connects the second stress buffer to the support frame, and a second part 34 that connects the two stress buffers 40'. Three parts36. Each stress buffering portion 40' in the shape of a labyrinth and the reference Figure 6 The stress buffering portion of Example 2 already described is the same. The beam 30 holding the two stress buffers 40' is formed symmetrically about the intersection point P of the beam'...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An acceleration sensor whose characteristics including sensitivity are less likely to change relative to disturbance force applied to a sensor chip. The acceleration sensor has a support frame, a weight supported within the support frame via flexible beams, semiconductor piezo-resistance elements provided on the beams, and wiring interconnecting the piezo-resistance elements. The acceleration sensor detects acceleration from changes in resistance in the piezo-resistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezo-resistance elements are provided. Each stress damping section is symmetrical about the crossing point between the longitudinal center line and the lateral center line of the beam. When turbulence force is applied to a sensor element in the direction in which the entire each of the beams extends, the stress damping section absorbs the turbulence force. Because stress in the direction in which the entire each of the beams extends is less likely to change, undeformability of the beam is less likely to change, and this reduces a change in the sensitivity of the acceleration sensor caused by turbulence force.

Description

technical field [0001] The present invention relates to a semiconductor acceleration sensor for detecting acceleration used in automobiles, airplanes, portable terminal devices, toys and the like. Background technique [0002] Acceleration sensors are mostly used for the operation of airbags, and the impact of a car collision is processed as acceleration. In automobiles, it is sufficient to have a single-axis or dual-axis function for measuring the acceleration in the X-axis direction and / or the Y-axis direction. In addition, since the acceleration to be measured is very large, the acceleration sensor element that detects the acceleration must also be manufactured as a strong element. Recently, portable terminal devices, robots, etc. are also used frequently, and in order to detect spatial motion, a three-axis acceleration sensor that measures acceleration in the X, Y, and Z-axis directions is required. In addition, in order to detect minute accelerations, a high-resolutio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/12H01L29/84H01L41/08G01P15/18H10N30/00
CPCH01L2224/45015H01L2224/32245G01P15/123H01L2224/48091H01L24/45G01P15/18H01L2224/73265H01L2224/48247H01L2924/3025H01L2224/45144H01L2924/1461H01L2924/181H01L2224/32145H01L2224/48145G01P2015/0842H01L2924/00014H01L2924/00H01L2924/20752H01L2924/00012
Inventor 风间敦斋藤正胜冈田亮二青野宇纪
Owner HITACHI METALS LTD