External connection heat radiator encapsulation structure of positive installation reverse T-shaped lock hole of base island embedded chip
A packaging structure and heat dissipation block technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of small and limited metal-based islands in size and area, and avoid rapid aging or even burns or burns Bad, strong heat dissipation effect
Inactive Publication Date: 2010-07-07
JCET GROUP CO LTD
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Problems solved by technology
[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.
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[0020] see Figure 5 , Figure 5 It is a schematic diagram of the packaging structure of the base island embedded chip in front of the inverted T locking hole heat sink block and external heat sink of the present invention. Depend on Figure 5 It can be seen that the packaging structure of the base island embedded in the chip of the present invention is mounted on the inverted T locking hole heat dissipation block and externally connected to the heat sink, including the chip 3, the metal base island 1 carried below the chip, the metal inner pin 4, and the chip to the metal inner pin The metal wire 5 for the signal interconnection, the conductive or non-conductive heat-conducting bonding substance I2 between the chip and the metal-based island, and the plastic package 8, the metal-based island 1 is embedded in the plastic packaging compound 8, above the chip 3 A heat dissipation block 7 is provided with a locking hole 7.1, and a conductive or non-conductive thermally conducti...
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The invention relates to an external connection heat radiator encapsulation structure of a positive installation reverse T-shaped lock hole of a base island embedded chip, which comprises a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a first conductive or nonconductive heat-conductive adhesive material (2) and a plastic encapsulation body (8), wherein the first conductive or nonconductive heat-conductive adhesive material (2) is arranged between the chip and the metal base island, and the metal base island (1) is embedded into the plastic encapsulation body (8). The invention is characterized in that a heat radiation block (7) is arranged above the chip (3), the heat radiation block (7) is provided with a lock hole (7.1), a second conductive or nonconductive heat-conductive adhesive material (6) is embedded and arranged between the heat radiation block (7) and the chip (3), a heat radiator (11) is arranged above the heat radiation block (7), the heat radiator (11) is fixedly connected with the heat radiation block (7) through the lock hole (7.1) by a screw (12), and the heat radiation block (7) is in a reverse T shape. The encapsulation structure of the invention can provide strong heat radiation capability.
Description
(1) Technical field [0001] The invention relates to a base island embedded chip front-mounted inverted T locking hole heat dissipation block external radiator packaging structure. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very ...
Claims
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Login to View More IPC IPC(8): H01L23/367
CPCH01L2224/49171H01L2224/32245H01L2224/73215H01L2924/0002H01L2224/48091H01L2224/73265H01L2224/48247
Inventor 王新潮梁志忠顾炯炯
Owner JCET GROUP CO LTD