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Method and electrolytic bath for reducing thickness of metal layer of base plate

A metal layer and electrolytic cell technology, applied in the field of electrolytic cells, can solve the problems of large expansion and contraction of printed circuit boards

Active Publication Date: 2012-05-09
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the mechanical polishing manufacturing method usually contacts and exerts pressure on the printed circuit board, so there is a great expansion and contraction problem for the printed circuit board

Method used

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  • Method and electrolytic bath for reducing thickness of metal layer of base plate
  • Method and electrolytic bath for reducing thickness of metal layer of base plate
  • Method and electrolytic bath for reducing thickness of metal layer of base plate

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Embodiment Construction

[0017] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention will be specifically cited below, together with the accompanying drawings, for a detailed description as follows:

[0018] Please refer to figure 1 , which shows the metal layer thickness reduction method for a substrate according to the first embodiment of the present invention. Please refer to figure 2 , in step 152, an electrolytic cell 110 is provided, which includes at least one pair of anode 112 and cathode 114, and an electrolyte 116, wherein the anode 112 and cathode 114 are located in the electrolyte 116, and the anode 112 It has the shape of a cylindrical roller. The anode 112 can be in the shape of a solid or hollow cylinder. The cathode 114 has the same shape as the anode 112 , for example, the cathode 114 also has a cylindrical shape.

[0019] In step 154 ​​the anode is rotat...

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Abstract

The invention discloses an electrolytic bath for reducing the thickness of the metal layer of a base plate. The electrolytic bath comprises electrolyte and at least a pair of anode and cathode. The anode and the cathode are arranged in the electrolyte. The anode is of the shape of a columnar roller and the metal layer is in contact with the anode.

Description

【Technical field】 [0001] The present invention relates to an electrolytic cell, and more particularly to an electrolytic cell for reducing the thickness of a metal layer, the anode of which has the shape of a cylindrical roller, and the metal layer is in contact with the anode. 【Background technique】 [0002] The chemical mechanical polishing (CMP) manufacturing method is to press a workpiece on a rotating polishing pad, supply a corrosive processing fluid to the workpiece, and then use relative motion to perform processing and polishing. When the workpiece is etched, the polishing material with fine abrasive grains is supplied at the same time, so that the thickness of the workpiece can be reduced. [0003] U.S. Patent Publication No. 2007 / 0264755A1, titled "Method Of Manufacturing Printed Circuit Board For Fine Circuit Formation", discloses a printed circuit board for forming microcircuits. The manufacturing method can replace the existing chemical mechanical polishing (C...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25F7/00C25F3/00H05K3/04
Inventor 翁肇甫王昱祺
Owner ADVANCED SEMICON ENG INC