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Subrack and heat radiating method thereof

A heat dissipation method and box insertion technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment shells/cabinets/drawers, etc., can solve the problems of reducing the competitiveness of electronic products, low integration, and quantity reduction, etc. To achieve the effect of reducing volume or height and ensuring heat dissipation effect, improving compactness, and reducing height or volume

Inactive Publication Date: 2012-07-04
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This has just resulted in the higher height of the subrack 10 in the prior art, resulting in a reduction in the number of configurable subracks 10 in the cabinet, and a low level of integration, which reduces the competitiveness of electronic products.

Method used

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  • Subrack and heat radiating method thereof
  • Subrack and heat radiating method thereof
  • Subrack and heat radiating method thereof

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] In the description, certain terms are used herein for reference only and therefore are not meant to be limiting. For example, terms such as "upper," "lower," "above," "below," etc. refer to directions in the drawings to which reference is made. The terms "first," "second," and other such numerals referring to structures do not imply a sequence or order unless clearly indicated by the context.

[0029] Such as image 3 As shown, the embodiment of the presen...

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Abstract

The embodiment of the invention provides a subrack and a heat radiating method thereof. The subrack comprises a subrack casing and a fan for driving air to flow, a back plate is arranged in the subrack casing, two sides of the back plate are respectively connected with electronic equipment, an air inlet channel is formed on the back plate and one end of the electronic equipment at the two sides of the back plate, an air inlet is arranged on the subrack casing on one side of the back plate, an air outlet channel is formed on the back plate and the other end of the electronic equipment at the two sides of the electronic equipment, an air outlet is arranged on the subrack casing on the other side of the back plate, the electronic equipment on one side of the back plate and the electronic equipment on the other side of the back plate are arranged in an interlaced way along the height direction of the back plate and arranged to be along the direction that the air flow flows through the electronic equipment, and the electronic equipment on one side of the back plate protrudes out of the electronic equipment on the other side of the back plate. By adopting the subrack structure of the embodiment, the height and the volume of the subrack can be effectively reduced on the basis of guaranteeing the radiating effect, thereby enhancing the compactness of the electronic products.

Description

technical field [0001] The invention relates to the communication field, in particular to a subrack and a heat dissipation method for the subrack. Background technique [0002] With the development of electronic products, the heat consumption of electronic components in electronic products continues to increase, and the problem of heat dissipation of electronic components is becoming more and more important. Electronic heat dissipation technology needs to ensure that the electronic components of electronic products work within the allowable temperature range, so as to ensure the reliability of electronic products. [0003] Heat dissipation methods can be divided into natural heat dissipation and forced air cooling. Among them, the forced air cooling is to drive the air through the heating device through the fan, so as to take the heat out of the device. The forced air cooling is mostly used in the occasions with high heat generation and severe ambient temperature. [0004]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K5/00
Inventor 敖峰杨正东许继业韩茜
Owner HUAWEI TECH CO LTD
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