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Sensor matrix with semiconductor components

A sensor matrix, semiconductor technology, applied in the field of components equipped with organic semiconductor materials, can solve the problems of local limitation and difference of affected signal levels, etc.

Active Publication Date: 2010-08-11
ASMAG HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In cases where high resolution of the acquisition parameters is required, locally limited large differences in the affected signal level can occur due to the characteristics of the affected signal

Method used

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  • Sensor matrix with semiconductor components
  • Sensor matrix with semiconductor components
  • Sensor matrix with semiconductor components

Examples

Experimental program
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Effect test

Embodiment Construction

[0046] First of all, it should be noted that the same components described in different embodiments are denoted by the same reference numerals and the same element names, and the disclosure of the entire specification may change the order according to the meaning of the same components using the same reference numerals or the same element names. Also, positions (such as above, below, sideways, etc.) selected for the purpose of illustration refer to the specifically described drawings and may be exchanged when describing another position according to the meaning of the new position. The individual features or the combination of features according to the different embodiments illustrated and described can be interpreted as an independent inventive technical solution or a technical solution proposed by the present invention itself.

[0047] figure 1 The sensor matrix 1 according to the invention is shown in an exploded sectional view. The first electrode arrangement 4 is applied...

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Abstract

The invention relates to a sensor matrix (1) with semiconductor components and a process for producing such a device, which sensor matrix comprises a laminar carrier layer (3), a first (4) and at least one second (10) electrode arrangement and a component arrangement (6). The first electrode arrangement (4) is disposed on a surface (2) of the carrier layer (3), and the component arrangement (6) is disposed on the first electrode arrangement (4) in the form of a plurality of organic semiconductor components (13). The second electrode arrangement (10) is arranged on a surface (8) of a top layer (9), and the top layer (9) is arranged over the carrier layer (3) so that the first (4) and second (10) electrode arrangements face one another and the second electrode arrangement (10) is in electrically conductive contact, at least in sections, with the component arrangement (6).

Description

technical field [0001] The invention relates to a sensor matrix with semiconductor elements, comprising a sheet-shaped carrier layer, a first electrode arrangement and at least one second electrode arrangement, and an element arrangement which is placed on the first electrode element and is equipped with multiple a semiconductor element, and the semiconductor element is equipped with an organic semiconductor material, and the first electrode arrangement is arranged on the surface of the carrier layer. The present invention also relates to a process for manufacturing a sensor matrix comprising the steps of: printing a first electrode arrangement onto a surface of a carrier layer; printing an element arrangement onto the first electrode arrangement; and printing at least a part of the contact portion to the element arrangement structure. Background technique [0002] Elements or sensors arranged in a matrix or grid form must be supplied with energy and identified measured val...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/30H01L27/32H10K99/00
CPCH01L51/0024H01L51/5203H01L2251/558H01L51/441Y02E10/549H01L27/307Y02P70/50H10K39/32H10K59/127H10K71/50H10K30/81H10K2102/351H10K50/805
Inventor F·帕丁内尔
Owner ASMAG HLDG