Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof

A technology of consolidating abrasives and polishing pads, applied in grinding/polishing equipment, abrasives, grinding devices, etc., can solve problems such as pollution, thin thickness of polishing pads, unstable performance, etc., to reduce production costs and improve processing efficiency The effect of stably improving and improving the machining surface shape accuracy and surface roughness

Active Publication Date: 2012-01-25
ECO POWER WUXI
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the serious pollution that most of the grinding and polishing in the current precision ultra-precision machining adopts free grinding and polishing liquid for processing, and the existing photocuring method is too thin in thickness and unstable in performance. To solve the problem, design a fixed abrasive polishing pad based on heat-induced solidification, and provide a preparation method of the polishing pad to meet the needs of precision ultra-precision grinding and polishing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof
  • Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A solidified abrasive polishing pad based on thermally induced solidification, with a structure such as figure 1 Shown. The abrasive layer (1) is manufactured by the following method: weigh 15 grams of cerium oxide abrasive with a particle size of 50 nanometers (it can also be replaced by silica, aluminum oxide or silicon carbide abrasives), and 30 grams of urethane acrylate (It is also possible to use bisphenol A epoxy acrylate, novolac epoxy acrylate ethyl amine modified epoxy acrylic, long fatty epoxy acrylate, polyester acrylate, chain modified by oleic acid and linoleic acid, Polyether acrylate or acrylated polyacrylate instead), 5 grams of azobisisobutyronitrile (dibenzoyl peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, acetoethyl ketone peroxide, peroxide Di-tert-butyl, dicumyl peroxide, methyl isobutyl ketone peroxide, 2,4-dichlorobenzoyl peroxide, dilauroyl peroxide, tert-butyl perbenzoate, cumene peroxide Hydrogen, 1,1-bis(tert-butylperoxy)cyc...

Embodiment 2

[0043] The nano-cerium oxide abrasive in implementation 1 is changed to diamond abrasive, the particle size of diamond is 500 nm, and the other composition is the same as the preparation process. The polishing pad prepared by the above method is used to polish a 3-inch quartz glass plate on a NANOPOL-100 polishing machine, the polishing pressure is 16KPa, the polishing disk speed is 80rpm, the polishing liquid does not contain any abrasives, and ethylenediamine is used to adjust the pH of the deionized water The value is 9, the surface roughness of the quartz plate after polishing reaches 3 nanometers.

Embodiment 3

[0045] Structure like figure 1 Shown. Among them, the abrasive layer (1) is manufactured by the following method: weigh 10 grams of diamond abrasive with a particle size of 14 microns (it can also be replaced by silicon dioxide, aluminum oxide, cerium oxide or silicon carbide abrasives), 40 grams Acrylated polyacrylate (also can use bisphenol A epoxy acrylate, novolac epoxy acrylate ethyl amine modified epoxy acrylic, use oleic acid, linoleic acid for chain modification of long fatty epoxy acrylate , Polyurethane acrylate, polyester acrylate or polyether acrylate instead), 2 grams of acetoethyl ketone peroxide (dibenzoyl peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, di-tert-butyl peroxide can also be used , Dicumyl peroxide, methyl isobutyl ketone peroxide, 2,4-dichlorobenzoyl peroxide, dilauroyl peroxide, tert-butyl perbenzoate, cumene hydrogen peroxide, 1, 1-Di(tert-butylperoxy)cyclohexane, tert-butyl perbenzoate, azobisisobutyronitrile, azobisisoheptonitr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses a grinding and polishing pad for a cured grinding material based on thermal initiation curing and a preparation method thereof, applied to the fields of precise and super precise grinding and polishing processing. The grinding and polishing pad is characterized in that a grinding material layer (1) contains the following components in percent by mass: 1-40 percent of grinding material with the granularity of 50 nanometers to 40 micrometers, 10-60 percent of prepolymer of polyacrylic ester, 0.5-7 percent of free radical / anions / oxidation-deoxidation thermal initiating agent, 0-2 percent of grinding material surface modifying and dispersing agent, 0-5 percent of accelerator, 0-20 percent of performance tuning additive and 5-40 percent of activated thinner of esterified acrylic acid. The preparation method of the grinding and polishing pad comprises the following steps of: (1) sufficiently and uniformly mixing raw materials; (2) preparing a polishing pad mould and preparing an abrasive particle layer by mould pouring, heating and curing; and (3) bonding the grinding material layer with an elastic or (and) rigid layer by using a bonding agent according to requirements to obtain the grinding and polishing pad required by the invention. The grinding and polishing pad prepared by adopting a thermal initiation curing method has stable processing performance, high processing efficiency and functions of hydrophily and self-correction and is suitable for precise and super precise processing.

Description

Technical field [0001] The invention relates to a polishing pad for ultra-precision processing and a preparation method thereof, in particular to a hydrophilic fixed abrasive polishing pad that can be applied to industries such as semiconductor, optics, intraocular lens and computer hard disk processing, and a preparation method thereof. It is a kind of solidified abrasive polishing pad based on thermally induced solidification and its preparation method. Background technique [0002] According to iSuppli's research, due to the promotion of standards such as 3G and the demand for digital home appliances and network markets, China's semiconductor market in 2009 was US$68.2 billion. Under the dual role of export growth and domestic demand, China's semiconductor market is expected to grow by 17.8% in 2010. The rapid growth of LEDs has led to its substrate material sapphire (Al 2 O 3 ) Demand soared. In addition, laser crystals (such as Ruby, Ti:Sapphire, YVO 4 The demand for cryst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00B24D18/00
Inventor 朱永伟左敦稳李军叶剑锋樊吉龙孙玉利
Owner ECO POWER WUXI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap