Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof

A technology for bonding abrasives and polishing pads, used in grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of pollution, thin polishing pad thickness, unstable performance, etc., to reduce production costs and processing efficiency. The effect of steadily improving and improving the machining surface shape accuracy and surface roughness

Active Publication Date: 2010-09-01
ECO POWER WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the serious pollution that most of the grinding and polishing in the current precision ultra-precision machining adopts free grinding and polishing liquid for processing, and the existing photocuring method is too thin in thickness and unstable in performance. To solve the problem, design a fixed abrasive polishing pad based on heat-induced solidification, and provide a preparation method of the polishing pad to meet the needs of precision ultra-precision grinding and polishing

Method used

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  • Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof
  • Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof

Examples

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Effect test

Embodiment 1

[0040] A kind of solid abrasive grinding and polishing pad based on thermally induced solidification, its structure is as figure 1 shown. The abrasive layer (1) wherein is made by the following method: take 15 grams of cerium oxide abrasives (also available silicon dioxide, aluminum oxide or silicon carbide abrasives to replace) with a particle diameter of 50 nanometers, 30 grams of polyurethane acrylate (It is also possible to use bisphenol A epoxy acrylate, epoxy acrylic acid modified by ethylamine of novolac epoxy acrylate, long fatty epoxy acrylate, polyester acrylate, polyester acrylate, etc. Polyether acrylate or acrylated polyacrylate instead), 5 grams of azobisisobutyronitrile (dibenzoyl peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, acetyl ethyl ketone peroxide, peroxide Di-tert-butyl, dicumyl peroxide, methyl isobutyl ketone peroxide, 2,4-dichlorobenzoyl peroxide, dilauroyl peroxide, tert-butyl perbenzoate, cumene peroxide Hydrogen, 1,1-bis(tert-bu...

Embodiment 2

[0043] The nano-cerium oxide abrasive in Implementation 1 was changed to diamond abrasive, the particle size of diamond was 500 nanometers, and other compositions were the same as the preparation process. Adopt the polishing pad of above-mentioned method preparation, in NANOPOL-100 polishing machine polishing 3 inches of quartz glass plates, polishing pressure is 16KPa, and polishing disk rotating speed is 80rpm, does not contain any abrasive material in the polishing liquid, adopts ethylenediamine to regulate the pH of deionized water With a value of 9, the surface roughness of the polished quartz plate reaches 3 nm.

Embodiment 3

[0045] structured as figure 1 shown. Wherein the abrasive material layer (1) is manufactured by the following method: take 10 grams of diamond abrasives (also available silicon dioxide, aluminum oxide, cerium oxide or silicon carbide abrasives to replace) with a particle size of 14 microns, 40 grams Acrylated polyacrylate (also can use bisphenol A epoxy acrylate, epoxy acrylic acid modified by ethylamine of novolac epoxy acrylate, long aliphatic epoxy acrylate modified by oleic acid and linoleic acid , polyurethane acrylate, polyester acrylate or polyether acrylate instead), 2 grams of acetoacetone peroxide (dibenzoyl peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, di-tert-butyl peroxide , dicumyl peroxide, methyl isobutyl ketone peroxide, 2,4-dichlorobenzoyl peroxide, dilauroyl peroxide, tert-butyl perbenzoate, cumene hydroperoxide, 1, 1-bis(tert-butylperoxy)cyclohexane, tert-butyl perbenzoate, azobisisobutyronitrile, azobisisoheptanonitrile, tert-butyl pero...

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Abstract

The invention discloses a grinding and polishing pad for a cured grinding material based on thermal initiation curing and a preparation method thereof, applied to the fields of precise and super precise grinding and polishing processing. The grinding and polishing pad is characterized in that a grinding material layer (1) contains the following components in percent by mass: 1-40 percent of grinding material with the granularity of 50 nanometers to 40 micrometers, 10-60 percent of prepolymer of polyacrylic ester, 0.5-7 percent of free radical / anions / oxidation-deoxidation thermal initiating agent, 0-2 percent of grinding material surface modifying and dispersing agent, 0-5 percent of accelerator, 0-20 percent of performance tuning additive and 5-40 percent of activated thinner of esterified acrylic acid. The preparation method of the grinding and polishing pad comprises the following steps of: (1) sufficiently and uniformly mixing raw materials; (2) preparing a polishing pad mould and preparing an abrasive particle layer by mould pouring, heating and curing; and (3) bonding the grinding material layer with an elastic or (and) rigid layer by using a bonding agent according to requirements to obtain the grinding and polishing pad required by the invention. The grinding and polishing pad prepared by adopting a thermal initiation curing method has stable processing performance, high processing efficiency and functions of hydrophily and self-correction and is suitable for precise and super precise processing.

Description

technical field [0001] The invention relates to a polishing pad for ultra-precision machining and a preparation method thereof, in particular to a hydrophilic consolidated abrasive polishing pad and a preparation method thereof which can be applied to industries such as semiconductor, optics, artificial crystal and computer hard disk processing, etc. The invention relates to a solid abrasive grinding and polishing pad based on heat-induced curing and a preparation method thereof. Background technique [0002] According to the research of iSuppli, due to the promotion of 3G and other standards, the demand of digital home appliances and network market, the Chinese semiconductor market in 2009 was 68.2 billion US dollars. Under the dual effects of export growth and domestic demand, China's semiconductor market is expected to grow by 17.8% in 2010. The rapid growth of LED led to its substrate material sapphire (Al 2 o 3 ) soared in demand. In addition, laser crystals (such a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D11/00B24D18/00
Inventor 朱永伟左敦稳李军叶剑锋樊吉龙孙玉利
Owner ECO POWER WUXI
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