Base plate, semiconductor packaging piece applying same and manufacture method of base plate

Abstract

The invention relates to a base plate, a semiconductor packaging piece applying the same and a manufacture method of the base plate. The base plate comprises a patterning line layer, a first dielectric protection layer, a metal shielding layer, a metal supporting layer and a second dielectric protection layer. The patterning line layer is provided with a groove as well as a first face and a second face which are opposite, wherein the groove penetrates through the second face from the first face, the first face is provided with a plurality of first junctions and a plurality of second junctions, and the first junctions are adjacent to the groove. The first dielectric protection layer is formed on the first face and exposes the first junctions and the second junctions. The second dielectric protection layer is formed on the second face and exposes the groove. The metal supporting layer is burned in the first dielectric protection layer, and the metal shielding layer is clamped between the metal supporting layer and the patterning line layer.

Description

technical field [0001] The present invention relates to a substrate, a semiconductor package using the same and a manufacturing method thereof, and in particular to a substrate with a support structure that can be strengthened, a semiconductor package using the same and a manufacturing method thereof. Background technique [0002] A conventional substrate includes a base material, an upper patterned circuit layer and a lower patterned circuit layer and has through holes. In order to increase the laying area of ​​the circuit on the substrate and increase the number of I / O contacts, the upper patterned circuit layer and the lower patterned circuit layer are respectively formed on two opposite surfaces of the base material, and are electrically connected to each other through conducting through holes. A chip can be disposed on the substrate to form a semiconductor package with the substrate. [0003] However, the traditional base material is a whole piece of plastic substrate,...

AI Technical Summary

Problems solved by technology

[0003] However, the traditional base material is a whole piece of plastic substrate, which has a thick thickness and a large volume, so that the volume of the final semiconductor package cannot be effectively reduced.

Moreover, the formation of through-holes on the base material will also reduce the structural strength of the board

In this case, in order to maintain the structural strength of the substrate, it is necessary to select a thicker substrate, which will make the volume of the traditional semiconductor package unable to be effectively reduced

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