Packaging substrate structure and manufacturing method thereof

Abstract

The invention relates to a packaging substrate structure and a manufacturing method thereof. The manufacturing method of the packaging substrate comprises the following steps of: providing a semiconductor base plate which is provided with one surface; forming a first etching mask on the surface of the semiconductor base plate, wherein the first etching mask is provided with an etching window which has a side wall extending along a first direction, an excursion angle exists between the first direction and the crystal lattice direction of the semiconductor base plate, and the excursion angle is more than zero degree and less than 45 degrees or no more than 90 degrees but more than 45 degrees; carrying out selective non-isotropic etching on the semiconductor base plate by applying the first etching mask and the etching window, and further etching an inclined plane on the surface of the semiconductor base plate along the first direction; forming a second etching mask on the inclined plane, wherein the second etching mask is provided with a plurality of etching windows; and etching the inclined plane by applying the second etching mask and the etching windows so as to etch a micro-optical diffraction assembly with a plurality of groove structures on the inclined plane.

Description

technical field [0001] The invention relates to a packaging base structure and a manufacturing method, in particular to a packaging base structure and a manufacturing method for packaging a light-emitting component. Background technique [0002] In many optoelectronic systems, there is often a need to change the path of light travel. E.g figure 1 As shown in , it deflects the light beam generated by the light-emitting component 11 to a non-coplanar plane with the substrate 10, and in a common method, it is a glass block 12 with a 45-degree inclined reflective surface 120 to encapsulate the key It is connected to the substrate 10, and finally a micro optical lens (Micro Lens) 13 is packaged on the upper edge of the reflective surface 120 to focus and collimate the light deflected to a non-coplanar place. However, this architecture requires extremely expensive packaging costs, because the light-emitting component 11, the glass block 12 and the micro-optical lens 13 belong to...

AI Technical Summary

Problems solved by technology

However, this architecture requires extremely expensive packaging costs, because the light-emitting component 11, the glass block 12 and the micro-optical lens 13 belong to three separate components (Discrete Elements) that are manufactured separately, and the package on the substrate 10 needs to be considered. Alignment accuracy between components, so that the manufacturing cost is not easy to reduce and the possibility of mass production (Mass Production) is extremely low

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