Non-flammable cleaner composition

A cleaning composition, non-flammable technology, applied in the direction of non-surface active detergent composition, detergent composition, organic non-surface active cleaning composition, etc., can solve the problems of slow drying of IPA, easy to produce stains, etc. achieve high reliability
CN101835884BInactive Publication Date: 2012-05-30SENJU METAL IND CO LTD +1

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
SENJU METAL IND CO LTD
Publication Date
2012-05-30
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A bromine-containing solvent, which has been used as an alternative solvent to a chlorofluorocarbon solvent or a chlorine-containing solvent, is characterized in that it is likely to degrade compared with a chlorofluorocarbon solvent or a chlorine-containing solvent. In the conventional bromine-containing cleaner compositions, the degradation of the compositions are prevented by using a corrosion-protecting agent or a stabilizing agent (e.g., nitroethane). However, when the cleaner compositions are used as cleaners for print circuit boards, the reduction in insulation resistance or leak failure is often caused. Thus, provided is a non-flammable cleaner composition comprising a mixture of a bromide selected from n-propylbromide, methylenebromide, bromochloromethane, n-butylbromide, isobutylbromide, sec-butylbromide and ter-butylbromide as a stabilizer for a bromine-containing solvent and an alkene- or alkyne-type hydrocarbon having 4 to 10 carbon atoms.
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Description

technical field

[0001] The present invention relates to a non-flammable cleaning composition, and in particular to a non-flammable cleaning composition used for flux cleaning of printed boards, electronic parts, etc., and degreasing of electronic parts and structural parts. Background technique

[0002] When flux residues are attached to printed circuit boards and electronic components used in electronic equipment that emphasizes reliability, after a long period of time, the flux residues will absorb moisture, or impurities, dust, etc. will adhere to the flux residues, which will not only cause Deterioration of the insulation, and also lead to adverse effects such as corrosion products. Therefore, these printed circuit boards and electronic components are washed after solder dipping.

[0003] In addition, if the parts used for precision instruments are left in the process of production, such as cutting oil adhering to the cutting process, lubricants adhering to the plastic ...

Claims

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