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Apparatus, system and method of in-situ identification

A technology of detection device and detection method, applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., can solve work safety accidents, cross-contamination and other problems

Active Publication Date: 2010-11-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

However, wafers that should be processed by other processes may be misplaced in the FOUP, which can cause cross-contamination and even lead to work safety accidents

Method used

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  • Apparatus, system and method of in-situ identification
  • Apparatus, system and method of in-situ identification
  • Apparatus, system and method of in-situ identification

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Embodiment Construction

[0016] It will be appreciated that the following description provides various embodiments to illustrate various features of the present invention. To simplify the description, specific embodiments, units, and combinations will be described. However, these specific examples are not intended to limit the present invention. In addition, in order to simplify the description, the present invention uses the same symbols in different drawings to denote similar elements in different embodiments, and the above repeated symbols do not mean that elements in different embodiments have the same corresponding relationship. For example, forming an element on another element includes the two elements being in direct contact, or the two being spaced by other elements.

[0017] In semiconductor processing, different wafer fabrication facilities (FABs) are used to form integrated circuit components. Integrated circuit components can be formed after processing a single wafer or a batch / lot of w...

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Abstract

An apparatus of in-situ indentification is provided that includes a load port for receiving a container that houses a wafer and a detector disposed proximate the load port such that the detector detects a metal characteristic of the wafer. The detected metal characteristic indicates whether the wafer is at a proper location. Also, provided is a method for use in semiconductor manufacture that includes providing a container that houses a wafer, receiving the container in a load port, detecting a metal characteristic of the wafer, and determining whether the wafer is at a proper location based on the detected metal characteristic of the wafer. The invention prevents cross-pollution or work safety misadventure due to the wafer of other technology misplaced in the FOUP.

Description

technical field [0001] The present invention relates to a semiconductor process, in particular to an on-site detection device for its application. Background technique [0002] In various processes for mass production of semiconductor components, various machines are required. Between different machines, it is often necessary to move single wafers or batches / batches of wafers by means of automatic transportation. Generally, single wafers or batches / lots of wafers are stored in containers such as front opening unified pods (FOUPs) and transported to appropriate locations by overhead transport services (OHTs). , such as into the load port of a process appliance. However, wafers that are supposed to undergo other processes can be misplaced in FOUPs, which can cause cross-contamination and even work safety incidents. SUMMARY OF THE INVENTION [0003] The present invention provides an in-situ inspection device, comprising a load port for receiving a container for storing waf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L21/67265
Inventor 苏昭安阮志鸣林炳辰范扬楷
Owner TAIWAN SEMICON MFG CO LTD
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