Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus, system and method of in-situ identification

A technology of detection device and detection method, applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as cross-contamination, work safety accidents, etc.

Active Publication Date: 2012-05-23
TAIWAN SEMICON MFG CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, wafers that should be processed by other processes may be misplaced in the FOUP, which can cause cross-contamination and even lead to work safety accidents

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus, system and method of in-situ identification
  • Apparatus, system and method of in-situ identification
  • Apparatus, system and method of in-situ identification

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] It is to be understood that the following disclosure provides various examples to illustrate various features of the invention. In order to simplify the description, specific embodiments, units, and combinations will be used for description. However, these specific examples are not intended to limit the present invention. In addition, in order to simplify the description, the present invention uses the same symbols in different drawings to indicate similar components in different embodiments, and the above repeated symbols do not mean that the components in different embodiments have the same corresponding relationship. For example, forming an element on another element includes the two elements being in direct contact, or the two elements being separated by other elements.

[0017] In the semiconductor process, different wafer fabrication facilities (FAB) are required to form integrated circuit devices. Integrated circuit devices can be formed after processing a sing...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An apparatus of in-situ indentification is provided that includes a load port for receiving a container that houses a wafer and a detector disposed proximate the load port such that the detector detects a metal characteristic of the wafer. The detected metal characteristic indicates whether the wafer is at a proper location. Also, provided is a method for use in semiconductor manufacture that includes providing a container that houses a wafer, receiving the container in a load port, detecting a metal characteristic of the wafer, and determining whether the wafer is at a proper location based on the detected metal characteristic of the wafer. The invention prevents cross-pollution or work safety misadventure due to the wafer of other technology misplaced in the FOUP.

Description

technical field [0001] The invention relates to a semiconductor process, in particular to an on-site detection device applied thereto. Background technique [0002] In various processes of mass production of semiconductor components, various machines are required. Between different machines, it is often necessary to use automatic transport to move single or batch / batch wafers. Generally speaking, single wafers or batches / batches of wafers are stored in containers such as front opening unified pods (hereinafter referred to as FOUPs), and are transported to appropriate locations by overhead transport service (OHT) , such as connected to the load port (load port) of the process equipment. However, wafers that should be processed by other processes may be misplaced in the FOUP, which can cause cross-contamination and even lead to work safety accidents. Contents of the invention [0003] The present invention provides an on-site detection device, comprising a load port for r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L21/67265
Inventor 苏昭安阮志鸣林炳辰范扬楷
Owner TAIWAN SEMICON MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com