Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer cleaning device

A technology for cleaning devices and wafers, which is applied to cleaning methods and utensils, cleaning methods using tools, electrical components, etc., can solve the problems affecting processing quality and efficiency, poor sealing, complex structure, etc., and achieves simple and compact structure. The effect of preventing damage to the wafer and prolonging the life of the chip

Active Publication Date: 2010-11-17
CETC BEIJING ELECTRONICS EQUIP
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The common cleaning device is driven by the motor through the ball screw to move the brush up and down, so there are some problems, such as complex structure, poor sealing, poor flexibility, etc., which affects the improvement of processing quality and efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer cleaning device
  • Wafer cleaning device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments, but not as a limitation to the present invention.

[0014] see figure 1 , the wafer cleaning device, the drive motor 1 is installed on the piston rod of the cylinder device 14 through the mounting base 2, the axis of the drive motor 1 is parallel to the direction of motion of the piston rod, the motor shaft is connected to the rotating shaft 4, and the end of the rotating shaft 4 Connect with hairbrush 13. The end of the rotating shaft 4 is connected with the brush 13 through an elastic support. The structure and connection relationship of the elastic support are: the lower disc 10 is fixed on the end of the rotating shaft 4 through the lock nut 11, the upper end of the elastic support plate 12 is fixedly connected with the lower disc 10, and the lower end is connected with the brush 13. The uppermost end of the rotating shaft 4 is fixed in th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a wafer cleaning device, relating to the technical field of wafer cleaning devices of semiconductor special equipment. A drive motor is arranged on the piston rod of a cylinder body by a mounting seat, the axis of the drive motor is parallel with the movement direction of the piston rod, a motor shaft is connected with a spindle, and the end of the spindle is connected witha brush by an elastic holder. The invention can solve the problems of the prior art effectively, and realize flexible contact of the brush and wafers to prevent the wafers from damaging, thereby greatly improving cleaning quality and efficiency. The invention has the advantages of higher reliability and stability, simple and compact structure, convenient usage and long service life. The wafer cleaning device is particularly applicable to the semiconductor special equipment.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning devices for semiconductor special equipment Background technique [0002] In the process of wafer processing, semiconductor special equipment needs to use a brush to contact the wafer for cleaning to remove impurities. The common cleaning device is driven by a motor through a ball screw to move the brush up and down, which has some problems, such as complex structure, poor sealing, poor flexibility, etc., which affects the improvement of processing quality and efficiency. Contents of the invention [0003] The object of the present invention is to provide a wafer cleaning device, which can not only make the brush contact with the wafer flexibly, effectively prevent damage to the wafer, greatly improve the cleaning quality and efficiency, have high reliability and stability, but also have a simple and compact structure, easy to use Features of convenience and long life. [0004] The pres...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B08B1/04H01L21/00
Inventor 袁立伟王仲康衣忠波
Owner CETC BEIJING ELECTRONICS EQUIP