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Wafer two-fluid cleaning device

A cleaning device and a two-fluid technology are applied in liquid cleaning methods, cleaning methods and utensils, semiconductor/solid-state device manufacturing, etc., which can solve problems such as unsatisfactory cleaning effects, uneven spraying water flow, and weak spraying force. Achieve the effect of compact structure, high cleaning quality and efficiency, and flexible action

Inactive Publication Date: 2010-10-06
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The common cleaning device is to directly spray deionized water on the surface of the wafer with a fixed nozzle. Due to the large spray area, the spray force is not strong, and the spray water flow is uneven, so the cleaning effect is not ideal.

Method used

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  • Wafer two-fluid cleaning device
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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings and examples, but not as a limitation to the present invention.

[0015] see figure 1 , the wafer dual-fluid cleaning device is provided with a swing vertical bar 10, and the swing vertical bar 10 is provided with a purified air inlet 10-1, a deionized water inlet 9-1 and an aerosol nozzle 9-2; the swing vertical bar 10 is connected to the swing device . The structure of the swing vertical bar 10 is as follows: the deionized water inlet 91 and the aerosol nozzle 92 are arranged on the nozzle 9, and the nozzle 9 is connected with the purified air inlet pipe through pipe threads. The structure of the swing device is as follows: there is a swing bar 11 connected with the swing vertical bar 10, the swing bar 11 is connected with the vertical shaft 8, the vertical shaft 8 is connected with the bearing seat 4 through a bearing, and the shaft end of the vertical shaft 8 is conn...

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PUM

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Abstract

The invention provides a wafer two-fluid cleaning device and relates to the technical field of the wafer cleaning device used for semiconductor special equipment. The wafer two-fluid cleaning device is provided with an oscillating vertical bar, wherein the oscillating vertical bar is provided with a purified air inlet, a deionized water inlet and a gas spray nozzle; and the oscillating vertical bar is connected with an oscillating device. the invention can effectively solve the problems in the prior art and is characterized by high cleaning quality and efficiency, compact structure, small volume, convenient and flexible operation and the like; the nozzle can oscillate from side to side, the surface of the wafer can be uniformly cleaned; the rotating accuracy of the device is high, the service life is long, the device is convenient to process and produce; quick dry tiny particles can be formed by the device for cleaning instead of the water flow; the rotation angle and starting position of the nozzle can be adjusted; the scale and strength of the gas spray can be regulated by adjusting the flows and pressures of water and gas, different cleaning effects can be realized; and the device has good reliability and stability.

Description

technical field [0001] The invention relates to the technical field of a wafer cleaning device for semiconductor special equipment. Background technique [0002] After processing the surface of the wafer, the semiconductor special equipment needs to clean the wafer surface to remove impurities on the wafer surface. A common cleaning device is to directly spray deionized water on the surface of the wafer with a fixed nozzle. Due to the large spray area, the spray force is not strong, and the spray water flow is uneven, so the cleaning effect is not ideal. Contents of the invention [0003] The object of the present invention is to provide a two-fluid cleaning device for wafers, which has the characteristics of high cleaning quality and efficiency, compact structure, small volume, convenient and flexible use, and the like. [0004] The present invention is realized in the following way: a wafer dual-fluid cleaning device, which is characterized in that a swing vertical bar ...

Claims

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Application Information

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IPC IPC(8): B08B3/02H01L21/304
Inventor 袁立伟王仲康杨生荣王欣
Owner CETC BEIJING ELECTRONICS EQUIP