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Process for adsorbing plating catalysts, process for production of substrates provided with metal layers and plating catalyst containing fluid for use in both processes

A catalyst and substrate technology, applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of metal film or substrate deformation, difficult pattern plating, easy water absorption or dehydration, etc., and achieve adhesion excellent effect

Active Publication Date: 2010-12-08
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the high-frequency characteristics when used as metal wiring deteriorate because the obtained metal pattern has unevenness at the interface portion of the substrate.
In addition, in order to roughen the surface of the substrate, it is necessary to treat the surface of the substrate with a strong acid such as chromic acid, so there is a problem that complicated steps are required in order to obtain a metal pattern with excellent adhesion between the metal film and the substrate.
However, if this method is adopted, there arises a problem that since the graft polymer has a polar group, water absorption or dehydration easily occurs according to changes in temperature or humidity, and as a result, the formed metal film or substrate is deformed.
However, in this method, it is necessary to use a liquid for plating a catalyst solution which is soaked to some extent in the hydrophobic patterned resin layer having catalyst adsorption properties, and therefore, there is a problem that the plating solution is soaked even to such a hydrophobic pattern resin layer. On the surface of the hydrophobic substrate other than the patterned resin layer, it is difficult to perform pattern plating
Or, known such method: under the situation that makes whole substrate adsorb with catalyzer, cover non-pattern part with anti-plating film (めつきょジスト), thereby only the exposed pattern part is plated (for example, refer to Japanese Patent Laid-open No. 6-85433 bulletin), but there is such a problem in this method: the process of attaching the anti-plating film or removing the metal residue between the wirings, etc. is added, and the process is complicated
In addition, a method is known in which a hydrophilic ion-exchange group is introduced into a pattern portion to cause a difference in adsorption (for example, refer to Japanese Patent Laid-Open No. 2003-166068), but in this case, it is necessary to add Hydrophilic treatment may cause problems in power reliability

Method used

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  • Process for adsorbing plating catalysts, process for production of substrates provided with metal layers and plating catalyst containing fluid for use in both processes
  • Process for adsorbing plating catalysts, process for production of substrates provided with metal layers and plating catalyst containing fluid for use in both processes
  • Process for adsorbing plating catalysts, process for production of substrates provided with metal layers and plating catalyst containing fluid for use in both processes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0456] [Making of substrate]

[0457] As the substrate, polyimide (Capton 500H: Toray Dupon Co., Ltd.) having a thickness of 125 μm was used. The saturated water absorption rate of this base material in the environment of 25 degreeC and 50% of relative humidity was 1.0 mass %.

[0458] An insulating composition of the following composition was coated on the substrate by spin coating to a thickness of 3 micrometers, and left at 30° C. for 1 hour to remove the solvent, and then dried at 170° C. for 60 minutes, thereby An insulating layer (adhesion assisting layer 1) was formed.

[0459] (Formation of Adhesion Assisting Layer 1)

[0460] In 20 parts of ethyl diglycol acetate and 20 parts of mineral spirits, 20 parts by mass of bisphenol A type epoxy resin (epoxy equivalent is 185, the Epico one produced by oil-based Shieru Epokishi (strain)) t828), 45 parts by mass of cresol type novolac epoxy resin (epoxy equivalent is 215, the Epicuron N-673 manufactured by Dainippon Inki Ch...

Embodiment 2

[0508] In the same manner as in Example 1, a substrate B1 was obtained except that the adhesion-assisting layer 1 formed in Example 1 was replaced with an adhesion-assisting layer 2 formed by the method shown below. A patterned surface hydrophobic cured product layer was formed by the same method as in Example 1, except that the substrate B1 was used to obtain a substrate B2 having a surface hydrophobic cured product layer pattern.

[0509] (Formation of Adhesion Assisting Layer 2)

[0510] Using a filter cloth (#200 mesh) to filter and mix 11.9 parts by mass of jER806 (bisphenol F-type epoxy resin: manufactured by Japan Epoch Resin), and 4.7 parts by mass of LA7052 (Fenolite, curing agent: manufactured by Dainippon Inki Chemical Industry) , a mixed solution of 21.7 parts by mass of YP50-35EK (phenoxy resin, manufactured by Dongdu Chemical), 61.6 parts by mass of cyclohexanone, and 0.1 parts by mass of 2-ethyl-4-methylimidazole (curing accelerator) , so as to prepare the coat...

Embodiment 3～4

[0524] Adopt the same method as Example 1 to obtain a substrate with a copper film, the difference is that the solvent ratio of the plating solution in Example 1 is changed to the ratio recorded in the following table 1, and the same method as in Example 1 is adopted. method to evaluate. The results are shown in Table 1 below.

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Abstract

A process for adsorbing a plating catalyst which comprises the step of applying a photocurable composition which contains a compound bearing both a group interactive with a plating catalyst or a precursor thereof and a polymerizable group and which can be photopolymerized to form a surface-hydrophobic cured material satisfying the following requirements (1) and (2) to a substrate, the step of subjecting the resulting substrate to patternwise light exposure to cure the composition, the step of subjecting the resulting substrate to development to remove uncured part of the composition, and the step of bringing an aqueous fluid containing both a plating catalyst or a precursor thereof and an organic solvent into contact with the resulting substrate, wherein when the substrate provided with a patternwise surface -hydrophobic cured material layer is brought into contact with a palladium-containing test fluid, A and B, which refer respectively to a palladium adsorption (mg / m2) in an area covered with a surface-hydrophobic cured material layer and a palladium adsorption (mg / m<2>) in an area not covered therewith, satisfy the relationships (A) and (B): (A): 10mg / m<2> <= A <= 150mg / m<2>(B): 0mg / m<2> <= B <= 5mg / m<2> Requirement (1): the saturated water absorption under the conditions of 25 DEG C and relative humidity of 50% is 0.01 to 5mass%, and Requirement (2): the saturated water absorption under the conditions of 25 DEG C and relative humidity of 95% is 0.05 to 10mass%.

Description

technical field [0001] The present invention relates to an adsorption method of a plating catalyst, a method of manufacturing a substrate covered with a metal layer using the method, and a plating catalyst solution suitable for these methods, wherein the adsorption method of a plating catalyst is used to efficiently apply a plating catalyst onto the surface of a patterned hydrophobic substrate. Background technique [0002] Conventionally, metal wiring boards (on which wiring using a metal pattern is formed on the surface of an insulating substrate) have been widely used for electronic components or semiconductor elements. [0003] As a method of producing such a metal pattern material, the subtractive method is mainly used. The so-called subtraction method is a method in which, on a metal film formed on the surface of a substrate, a photosensitive photosensitive layer is provided by irradiating with active light rays, the photosensitive layer is image-wise exposed, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30
CPCC23C18/2086C23C18/1608C23C18/30
Inventor 佐藤真隆
Owner FUJIFILM CORP