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Dual ovenable food package having a thermoformable polyester film lid

A thermoforming and heatable technology, used in packaging, packaged food, household packaging, etc.

Inactive Publication Date: 2011-01-05
DUPONT TEIJING FILMS U S LLP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, polystyrene and polypropylene containers are only suitable for microwave ovens

Method used

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  • Dual ovenable food package having a thermoformable polyester film lid
  • Dual ovenable food package having a thermoformable polyester film lid
  • Dual ovenable food package having a thermoformable polyester film lid

Examples

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Embodiment Construction

[0024] The present invention is described below with reference to the drawings, wherein like numerals are used to identify like parts throughout. BRIEF DESCRIPTION OF THE DRAWINGS The present invention is not intended to serve as engineering or structural drawings, therefore they are not intended to be scale and do not include all components that may be included in these drawings since the inclusion of such components would unduly interfere with the drawings.

[0025] refer to figure 1 , showing a cross-section of a thermoformed heat-sealable composite film that can be used to produce lids for use in vacuum outer packaging according to the present invention.

[0026] The composite film 10 contains a substrate film layer 12 and a heat sealable layer 14 . The substrate film layer 12 is a thermoformable self-supporting polymeric film. The thermoforming process is a process that includes the following steps: heating the film above the glass transition temperature of the material...

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Abstract

The invention provides an ovenable vacuum skin package for storage and cooking of a food product. The package includes a receptacle and a thermoformable composite polymeric film cover heat-sealed thereto, and the composite polymeric film cover includes: (i) a thermoformable substrate layer comprising a first copolyester material; and (ii) on a surface of the substrate layer, a heat-sealable layer comprising a second copolyester material, the second copolyester material being different from the first copolyester material; wherein i. the receptacle comprises on a surface thereof a sealing region adapted to contact and form a seal with the heat-sealable layer; and ii. both the receptacle and the cover film comply with the requirements of paragraph h(1) of 21 CFR PRG 177.1630.

Description

technical field [0001] The present invention relates to vacuum surface food packaging for microwave and conventional ovens, and more particularly to food packaging capable of withstanding temperatures in excess of 425°F (218°C), the packaging having a thermoformable polyester film lid. Background technique [0002] Plastic containers have been increasingly used in packaging applications, such as food packaging, especially for "cook-in" packaged convenience foods, such as in microwave ovens or conventional ovens or either Heated, ready-to-bake meals. Today's busy consumers demand higher quality products, easy-to-use packaging and faster, more efficient cooking methods for greater flexibility in the kitchen. Being able to cook food in a conventional or microwave oven has practically become a necessity. [0003] Vacuum overpacking is a known method of packaging in which the food product is placed in a container and air is evacuated from the package before it is sealed. Such ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B65D77/20B65D81/34C08J7/04C08J7/043C08J7/052
CPCB65D81/2015C08J7/047C08J2467/00B65D81/343B65D81/3453C08J2367/00B32B27/36B32B27/08B32B2307/308B32B2439/70Y02P20/582C08J7/0427C08J7/052C08J7/043
Inventor 邓风华S·K·弗朗茨岑
Owner DUPONT TEIJING FILMS U S LLP