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Heat dissipation module

A technology of heat dissipation module and heat dissipation body, which is applied in cooling/ventilation/heating transformation, electrical components, electric solid state devices, etc., can solve the problems of high material cost, high production cost of heat dissipation module, difficult mold design, etc. The effect of reducing design difficulty and material cost

Inactive Publication Date: 2011-02-02
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wherein, the fixing plate and the base are integrally formed by die-casting of metal materials, which not only makes the mold design difficult, but also has relatively high material costs, so that the heat dissipation module has relatively high production costs.

Method used

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0015] figure 1 and figure 2 Shown is the heat dissipation module 100 in the first embodiment of the present invention, the heat dissipation module 100 includes a fixed plate 10, two fans 20 respectively fixed on the opposite sides of the fixed plate 10, respectively fixed on the two fans Two heat sinks 30 on 20 , a heat absorbing block 40 disposed at the bottom of the fixing plate 10 , and two heat pipes 50 respectively connected between the two heat sinks 30 and the heat absorbing block 40 .

[0016] The two fans 20 have the same structure and are both centrifugal fans. Each fan 20 includes a fan frame 21 and a fan wheel 22 accommodated in the fan frame 21 . The fan frame 21 includes a base 210 and a cover 211 covering the base 210 . Wherein, the base 210 is made of PBT (polybutylece terephthalate, polybutylene terephthalate) or ...

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Abstract

The invention relates to a heat dissipation module comprising a fixed plate, two fans, two heat dissipation bodies respectively fixed on the two fans, a heat absorption block arranged at the bottom of the fixed plate and two heat pipes respectively connected to the part between the two heat dissipation bodies and the heat absorption block, wherein each fan comprises a fan frame and a fan wheel pivoted to the fan frame; the fan frame comprises a base and a cover plate covered on the base; the fan frames of the two fans and the fixed plate are respectively molded; and each fan is fixed on the fixed plate through a fixed structure on the fan frame. The heat dissipation module has the advantages that the design difficulty of the module is reduced because the fan frames and the fixed plate are respectively molded, and the material cost is reduced because the fixed plate and the fan frames can be respectively made of different materials.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module used for heat dissipation of heating electronic components. Background technique [0002] With the rapid development of electronic technology, heating electronic components such as central processing units are developing towards high performance and high speed, which brings more and more heat generated by heating electronic components. If the heat is not dissipated in time , will seriously affect the reliability and service life of the heating electronic components, and even cause damage to the heating electronic components. For this reason, the industry usually installs a heat dissipation module on the heat-generating electronic component to dissipate heat from the heat-generating electronic component. [0003] The heat dissipation module includes a fixed plate, a fan base integrally formed with the fixed plate, a fan wheel accommodated in the base, a fin g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH01L23/467H01L23/427H01L2924/0002H01L2924/00
Inventor 廉志晟刘金标邓根平
Owner FU ZHUN PRECISION IND SHENZHEN