Adhesive composition for halogen-free coverlay film and coverlay film coated by the same
A cover film and adhesive technology, applied in the direction of film/sheet adhesive, non-polymer adhesive additive, adhesive type, etc., can solve the degradation of heat resistance and adhesive strength of cover film, The cover film does not meet the required properties, etc.
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Embodiment 1
[0051] The components shown in Table 1 below and methyl ethyl ketone with a solid content of 30% were added and uniformly mixed with a homogenizer. Next, the mixed composition was applied on a polyimide film having a thickness of 12.5 μm in such a manner that the thickness after drying was 25 μm, followed by drying and thermal curing in an oven at 50° C. for 10 minutes, and at 160° C. °C Dry in an oven and heat cure for 3 minutes. Finally, a release paper was laminated thereon to prepare a cover film.
Embodiment 2~4
[0053] Cover films were prepared in the same manner as in Example 1 except that the components of the adhesive were added as shown in Examples 2 to 4 of Table 1 below.
[0054] [Table 1]
[0055]
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