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Needling device of printed circuit board

A technology of printed circuit board and needle implantation, which is applied in the direction of assembling printed circuits, circuit/collector parts, and circuits with electrical components. Good guarantee and other issues to achieve the effect of improving needle implantation efficiency and good quality

Active Publication Date: 2012-11-14
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the laboratory, there is generally no such needle implantation equipment or tools. At present, the needle implantation of the printed circuit board can only be done by hand, so it takes a lot of manpower, and the quality of the needle implantation is not well guaranteed. Pins are easy to bend and deform

Method used

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  • Needling device of printed circuit board
  • Needling device of printed circuit board
  • Needling device of printed circuit board

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Embodiment Construction

[0017] In order to better understand the technical content of the present invention, specific embodiments are given and described as follows in conjunction with the accompanying drawings.

[0018] Please refer to figure 1 and figure 2 , figure 1 Shown is a side view of the structure of the needle planting device for printed circuit boards in a preferred embodiment of the present invention, figure 2 Shown is the front view of the structure of the printed circuit board needle planting device in the preferred embodiment of the present invention. The present invention proposes a needle planting device for a printed circuit board, including: a fixed base 500, a fixed base 100 for a printed circuit board, a fixed suction base 200 for pin pins, a movable connector 300 and a pressure bar 400, wherein the printed circuit board The fixed base 100 is arranged on the fixed base 500, and the pin pin fixed suction base 200 is located above the printed circuit board fixed base 100 and k...

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PUM

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Abstract

The invention provides a needling device of a printed circuit board, comprising a fixed base, a fixed pedestal of the printed circuit board, a pin needle fixed absorbing pedestal, a movable rod connecting piece and a pressure lever, wherein the fixed pedestal of the printed circuit board is arranged on the fixed base; the pin needle fixed absorbing pedestal is positioned above the fixed pedestal of the printed circuit board and keeps a certain distance and is movably connected with the pressure lever by the movable connecting piece; and one end of the pressure lever is connected with the fixed base. The needling device of the printed circuit board realizes the needling treatment on the printed circuit board, saves time and force, is convenient and quick and can ensure favorable quality ofthe needling simultaneously.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, and in particular to a needle planting device for a printed circuit board. Background technique [0002] With the improvement of integrated circuit design level and process technology, the scale of integrated circuits is getting larger and larger, the scale and complexity of chip design are also increasing sharply, and the number of pins of integrated circuit chips is also increasing. When these integrated circuit chips are packaged, a multi-process test is required to test the performance of the chip, for example, an Electro Static Discharge (ESD) test is performed. The packaging and testing machines that existing laboratories can provide only have a maximum of 64 pins. However, some integrated circuit chips have more than 100 packaging and bonding wires, so this demand cannot be met at all. [0003] In the prior art, the chip on board (COB) bonding process is used to meet the needs o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/00H01L21/48H05K3/32
CPCH01L2224/48091
Inventor 李刚郑鹏飞刘云海董伟淳
Owner SEMICON MFG INT (SHANGHAI) CORP