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Housing of electronic device and manufacturing method thereof

A technology of electronic devices and manufacturing methods, applied in the fields of electrical equipment casings/cabinets/drawers, decorative arts, telephone communications, etc., capable of solving problems such as environmental pollution

Inactive Publication Date: 2011-03-30
SHENZHEN FUTAIHONG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, both painting and electroplating have certain pollution to the environment

Method used

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  • Housing of electronic device and manufacturing method thereof
  • Housing of electronic device and manufacturing method thereof
  • Housing of electronic device and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0018] see figure 1 , figure 2 and image 3 , the electronic device casing 10 of the preferred embodiment of the present invention includes a metal base 11 , a soft layer 12 and an adhesive layer 13 bonding the base 11 and the soft layer 12 .

[0019] The substrate 11 can be made of metal materials such as stainless steel, copper, magnesium alloy, aluminum alloy and titanium alloy. The base body 11 includes a bonding surface 112 for bonding the soft layer 12 and a folded edge 114 folded to one side of the bonding surface 112 . In order to increase the adhesion of the substrate 11 to the soft layer 12, the bonding surface 112 is etched or polished to a rough surface. The extension length of the folded edge 114 is roughly equal to the sum of the thicknesses of the soft layer 12 and the adhesive layer 13 .

[0020] The soft layer 12 is made of leather or fabric, such as natural leather, artificial leather, cotton fabric, fiber fabric, wool fabric, plastic fabric or nylon. T...

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PUM

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Abstract

The invention provides a housing of an electronic device, which comprises a metal base, a soft layer and an adhesive layer, wherein the soft layer is leather or fabric, the base comprises a binding face and a flange turning to one side of the binding face, the soft layer is combined with the binding face of the base through the boding layer, and the flange of the base covers the periphery of the soft layer. The invention also provides a method for manufacturing the enclosure of the electronic device.

Description

technical field [0001] The invention relates to an electronic device casing and a manufacturing method thereof. Background technique [0002] With the widespread use of electronic devices such as mobile phones, computers, and game consoles, the aesthetics and tactile effects of these electronic device housings have attracted more and more attention from consumers. [0003] Metal shells are applied to electronic devices due to their advantages of high strength and impact resistance. However, the appearance of the metal shell is relatively simple, and the touch is not soft. In order to make the metal casing have various decorative appearance effects, the surface of the metal casing is usually treated with spray paint or electroplating. However, painting and electroplating all have certain pollution to the environment. Contents of the invention [0004] In view of this, it is necessary to provide an environmentally friendly electronic device casing with high strength and s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00B44C1/10B44C7/00
CPCH04M1/0283H05K5/0243
Inventor 苏向荣赖文德
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD