Microchannel heat exchanger

Abstract

The invention relates to a microchannel heat exchanger comprising a plurality of heat exchanger plates (1) and a plurality of clapboards respectively and alternately laminated with the heat exchanger plates (1), wherein a first fluid channel (2) and a second fluid channel (18) which are alternately arranged are formed on the laminated surface of the heat exchanger plates (1), both ends of the first fluid channel (2) along the length direction of the first fluid channel (2) are sealed, both ends of the second fluid channel (18) along the length direction of the second fluid channel (18) are open, and a transversal through slot (4) which transversally extends along the length direction of the first fluid channel (2) is formed in a position, which corresponds to both ends of the first fluid channel (2), on the clapboards and communicated with the first fluid channel (2). The microchannel heat exchanger disclosed by the invention can exchange heat among the heat exchanger plates on the same layer and between heat exchanger plates and the clapboards of adjacent layers, therefore, a more sufficient heat exchanging effect is achieved.

Description

technical field [0001] The invention relates to a heat exchanger with a microscale structure, in particular to a microchannel heat exchanger manufactured by diffusion bonding technology for heat pump water heaters, condensers in heat dissipation of electronic equipment, gas coolers or evaporators. Background technique [0002] Refrigeration systems are inseparable from heat exchangers. With the development of technology and economy and the improvement of people's living standards, people have put forward more and more stringent requirements for the performance and volume of heat exchangers. Therefore, some small volume, heat transfer coefficient High-cost, low-cost microchannels have become the research object of scholars at home and abroad. The research and development of microchannel heat exchangers, as a substitute for plate heat exchangers in the future, has become a new direction for research and development of heat exchangers. Under the same heat exchange capacity, mic...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that the microchannel heat exchanger in the prior art only heats up on the same layer of chips or only heats up on adjacent chips, resulting in insufficient heat exchange. A microchannel heat exchanger capable of exchanging heat on chips of the same layer and adjacent layers

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