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Electroplating apparatus and electroplating method

A technology of electroplating device and electroplating solution, which can be used in plating baths, electrical components, electrolysis processes, etc., and can solve the problems of dissolved oxygen consumption and additive deterioration.

Active Publication Date: 2011-04-13
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, if a large amount of metal particles such as copper particles adhere to the filter, the dissolved oxygen in the plating solution may be consumed due to the metal particles, or additives (such as sulfur-based additives, etc.) contained in the plating solution may be deteriorated.
Therefore, in order to suppress the deterioration of the plating film quality, it is necessary to replace the filter frequently

Method used

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  • Electroplating apparatus and electroplating method
  • Electroplating apparatus and electroplating method
  • Electroplating apparatus and electroplating method

Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0032] like figure 1 As shown, the electroplating apparatus 11 of the first embodiment of the present invention is provided with: an electroplating tank 13, an auxiliary tank 15 different from the electroplating tank 13, a delivery side pipe 29 for sending the electroplating solution from the electroplating tank 13 to the auxiliary tank 15, and Return-side piping 41 that returns the plating solution from the auxiliary tank 15 to the plating tank 13 .

[0033] The plating tank 13 has a tank main body 47 having a substantially cubic shape with an open top, and an overflow tank 49 integrally provided with the tank main body 47 . Inside the tank main body 47, an anode 55 is arranged. Furthermore, the tank main body 47 is configured so that a cathode 57 as an object to be plated can be provided therein.

[0034] The anode 55 is respectively arranged on both sides of the cathode 57 . As the anode 55, a soluble anode or an insoluble anode is used. As a soluble anode, for example,...

no. 2 Embodiment approach

[0081] Figure 4 It is a structural diagram showing the auxiliary tank 15 of the plating apparatus 11 according to the second embodiment of the present invention. In this second embodiment, the structure of the first space 17 of the auxiliary tank 15 is different from that of the first embodiment. In addition, here, the same code|symbol is attached|subjected to the same component as 1st Embodiment, and detailed description is abbreviate|omitted.

[0082] like Figure 4 As shown, the auxiliary tank 15 has a second partition wall 35 in addition to the auxiliary tank main body 20 and the first partition wall 21 . The second partition wall 35 has a substantially rectangular shape and is erected upward from the bottom surface of the auxiliary tank main body 20 . The second partition wall 35 divides the inside of the first space 17 into two spaces. One of the spaces is a supply space 33 for receiving the plating solution supplied from the supply port 29a of the sending-side pipi...

no. 3 Embodiment approach

[0088] Figure 5 It is a block diagram showing the auxiliary tank 15 of the electroplating apparatus 11 according to the third embodiment of the present invention. In this third embodiment, the structure of the first space 17 of the auxiliary tank 15 is different from the first and second embodiments. In addition, here, the same code|symbol is attached|subjected to the same component as 1st Embodiment, and detailed description is abbreviate|omitted.

[0089] like Figure 5As shown, the auxiliary tank 15 has a second partition wall 35 in addition to the auxiliary tank main body 20 and the first partition wall 21 . The second partition wall 35 has a substantially rectangular shape, and is erected upward from the bottom surface of the auxiliary tank main body 20 similarly to the second embodiment described above. The second partition wall 35 divides the inside of the first space 17 into the supply space 33 and the settling space 31 . The difference from the second embodiment ...

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Abstract

The invention provides an electroplating apparatus and an electroplating method. The electroplating apparatus (11) includes: a plating tank (13) for holding plating solution; and a separate tank (15) apart from the plating tank (13), for holding the plating solution circulating between the plating tank (13) and the separate tank (15). The separate tank (15) contains a first space (17) and a second space (19) located downstream from the first space (17). The plating solution in the first space (17) in an amount exceeding a specific height flows from the first space (17) into the second space (19), and the plating solution falls through air in the second space (19).

Description

technical field [0001] The invention relates to an electroplating device and an electroplating method. Background technique [0002] Plating is used, for example, to form a wiring pattern on a printed circuit board. For example, in sulfuric acid copper plating, in order to obtain the properties of the film aimed at gloss, film physical properties, throwing ability, and fillability of via holes, so-called brighteners, carriers, and leveling agents are added to the plating solution. Various additives such as accelerators or inhibitors. [0003] These additives can effectively act as inhibitors on the substrate surface and as accelerators in through holes and via holes, thereby promoting the throwing of through holes and the filling of via holes. However, if the accelerator is excessive in the electroplating solution, the effect of the inhibitor on inhibiting the growth of active nuclei will decrease, making it difficult to obtain a dense film, resulting in a decrease in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D5/08C25D21/10C25D3/38H05K3/18
CPCC25D21/04C25D17/02C25D21/18C25D21/10C25D3/38
Inventor 礒野敏久立花真司大村直之星俊作松田加奈子清水宏治
Owner C UYEMURA & CO LTD