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Piezoelectric resonator, oscillator and oscillator package

A technology of piezoelectric vibrators and oscillators, applied in piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve problems such as performance degradation and temperature characteristic changes, and achieve Effects of reducing stress, suppressing frequency shift, and reducing characteristic deterioration

Inactive Publication Date: 2011-04-27
SII CRYSTAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When stress is applied to the piezoelectric vibrating reed 203, the temperature characteristics will change significantly, and there is a problem of performance degradation

Method used

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  • Piezoelectric resonator, oscillator and oscillator package
  • Piezoelectric resonator, oscillator and oscillator package
  • Piezoelectric resonator, oscillator and oscillator package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as Figure 1 ~ Figure 2 As shown, a piezoelectric vibrator 1 is a piezoelectric vibrator in which a piezoelectric vibrating reed 7 is mounted on a silicon substrate 2 via a metal film (linear expansion coefficient adjustment film) 3 and an insulating film 4 . In addition, in order to facilitate the observation of the drawing, the figure 1 Insulating film 4 is omitted.

[0031] according to Figure 1 ~ Figure 2 to explain. The piezoelectric vibrating piece 7 is an AT-cut vibrating piece formed of quartz as a piezoelectric material into a rectangular thin plate, and vibrates when a predetermined voltage is applied thereto. Rectangular excitation electrodes 10 , 11 are formed at positions facing each other at central portions of the front and back surfaces of the piezoelectric vibrating reed 7 . The excitation electrode 10 formed on the front surface of the piezoelectric vibrating piece 7 passes through one of its short sides ( figure 1 One-sided end ( figure...

Embodiment 2

[0055] The structure and effects of Embodiment 2 are substantially the same as those described in Embodiment 1. However, Embodiment 2 is an embodiment of an oscillator, and its main difference is that an oscillation circuit is formed on a silicon substrate 2 . Therefore, the description of the same configuration as that of the first embodiment will be omitted, and only the different points will be described.

[0056] image 3 , Figure 4 An oscillator 20 using the piezoelectric vibrator 1 of the first embodiment described above is shown. An oscillation circuit 21A is formed on the front surface of the silicon substrate 21 , and terminals 25 and 26 for connecting the piezoelectric vibrator and electrode terminals 27 , 28 , 29 , and 30 for the oscillation circuit are formed. In addition, on the front surface of the silicon substrate 21, in the form of forming openings at the portions of the piezoelectric vibrator connection terminals 25, 26 and the oscillation circuit electrod...

Embodiment 3

[0062] The structure and effect of Embodiment 3 are substantially the same as those described in Embodiment 1 and Embodiment 2. However, the main difference of Embodiment 3 is that the oscillation circuit is formed on the back side of the silicon substrate and the piezoelectric vibrating piece 7 is mounted on the front side of the silicon substrate. Therefore, descriptions of the same configurations as those of Embodiment 1 and Embodiment 2 will be omitted, and only the points of difference will be described. Figure 6 Since it is a cross-sectional view, only a part of the piezoelectric vibrator connection terminal and the oscillation circuit electrode terminal are shown in the figure, but the actual form has the same structure as that of the second embodiment.

[0063] exist Figure 6 In the illustrated oscillator 40 , an oscillation circuit 41A is formed on the back surface of a silicon substrate 41 , and a piezoelectric vibrator connection terminal 43 and electrode termina...

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PUM

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Abstract

Provided is a piezoelectric resonator having a structure in which the piezoelectric resonator chip is mounted on a silicon substrate without deteriorating a characteristic. The piezoelectric resonator includes a silicon substrate (2), a metal film (3) formed on a front surface of the silicon substrate (2), a pair of mount electrodes (5, 6) formed on the metal film (3), and an AT-cut type piezoelectric resonator chip (7) that is bump-bonded to the pair of mount electrodes (5, 6) to be supported. A linear expansion coefficient of the metal film (3) is 1310-6 per degrees centigrade or larger, and a product of the linear expansion coefficient and a Young's modulus of the metal film (3) is 1.95 MPa per degrees centigrade or larger.

Description

technical field [0001] The present invention relates to a surface mount type (SMD) piezoelectric vibrator, in particular to a piezoelectric vibrator for a small package with a size of 3.2 mm×2.5 mm or less. Background technique [0002] In recent years, piezoelectric vibrators using quartz or the like have been used as time sources, timing sources such as control signals, reference signal sources, and the like in mobile phones and mobile information terminal devices. As such a piezoelectric vibrator, various piezoelectric vibrators are known, and one of them is a surface mount type piezoelectric vibrator. Regarding such a piezoelectric vibrator, it is generally known that a piezoelectric vibrating reed is fixed to a base substrate on which internal electrodes are formed with a conductive adhesive, and sealed with a lid substrate. In particular, in recent years, the penetrating electrode technology of LSI has been developed, and furthermore, a mounting form in which passive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/19B81B3/00
CPCH03H9/0552H03H9/1021H03H9/0557H03H9/0519H03H9/0542
Inventor 吉田宜史
Owner SII CRYSTAL TECH