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Plate splicing method by surface mounting technique

A technology of operation and technology, applied in the direction of electrical components, electrical components, etc., can solve problems that have not been specifically disclosed, and achieve the effect of saving manufacturing costs and saving production operation time

Inactive Publication Date: 2012-12-12
KINPO ELECTRONICS CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] These issues are not specifically disclosed in the above reference data

Method used

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  • Plate splicing method by surface mounting technique
  • Plate splicing method by surface mounting technique

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Embodiment Construction

[0029] see figure 1 and figure 2 , the method for surface paste technology (SMT) jigsaw puzzle operation of the present invention, comprises:

[0030] Step (a): distributing a plurality of machine boards 10 on the production line 20 respectively, and the machine boards are all configured with tin oil or solder paste; in this embodiment, the machine boards 10 are sequentially defined as the first machine board 11, the second machine board Two machine boards 12.

[0031] Step (b): connecting operation, so that the first machine board 11 and the second machine board 12 are connected to form an integral state (or defined as a sub-assembly), and are delivered and moved together. This connecting step mainly connects the first machine board 11 and the second machine board 12 together; for example, using methods such as bonding, scarfing, etc. In this embodiment, the first machine board 11 and the second machine board 12 are connected and combined through the connector 30 being ar...

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Abstract

The invention discloses a plate splicing method by the surface mounting technique, which comprises the following steps: (a) a plurality of machine plates are respectively delivered on the production line, wherein all the machine plates are processed by tin oil or tin cream configuration, and orderly defined as the first machine plates and the second machine plates; (b) connecting: the first machine plates and the second machine plates are connected to form an integral state, and delivered and moved together; and (c) assembly configuration: the first and second machine plates are simultaneously delivered into an assembly configuration region through the production line, and an assembly configuration system arranged in the assembly configuration region continuously configures assemblies onto the first machine plates and the second machine plates, thereby reducing the time that the assembly configuration system waits for the machine plates to enter the configuration region.

Description

technical field [0001] The present invention relates to a surface mount technology (Surface Mount Technology) jigsaw method, in particular to a method for connecting at least two machine boards to form an assembly, and allowing the component configuration system to continuously arrange components on the assembly to reduce The method by which the job produces time. Background technique [0002] It is a conventional technology to use the production line to distribute circuit substrates or printed circuit boards through the surface mount technology (Surface Mount Technology) panel operation of tin oil and component configuration procedures. The existing surface-mounting technology assembly operation includes making multiple machine boards form intervals and distributing them on the production line, passing through the solder paste configuration program one by one; then, the production line distributes the machine boards into the component configuration area, allowing the compon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 陈忠贤
Owner KINPO ELECTRONICS CHINA