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Plate and diaphragm gripping device and method thereof

A grasping device and plate film technology, which is applied in the field of PCB manufacturing, can solve the problems of inaccurate positioning and easy generation of waste products, excessive alarm interruptions, and reduced production efficiency, and achieve a simple and practical method, reduced labor costs, and high production efficiency. Effect

Active Publication Date: 2011-05-11
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. Poor reliability;
[0008] 2. Excessive alarm interruptions reduce production efficiency;
[0009]3. When the board cannot be detected and the positioning is inaccurate, it is easy to produce waste products

Method used

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  • Plate and diaphragm gripping device and method thereof
  • Plate and diaphragm gripping device and method thereof
  • Plate and diaphragm gripping device and method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] refer to figure 1 , the embodiments of the plate film grabbing device of the present invention include:

[0029] at least two gripping units 10;

[0030] at least one pressing unit 20 located between the two grabbing units 10;

[0031] Drive the driving unit (not marked) of the grasping unit 10 and the pressing unit 20. When grabbing the plate film 60, the driving unit is used to drive the pressing unit 20 to press the inner side of the plate film 60, and drive the plate film 60. The grasping unit 10 grasps the outer periphery of the plate film 60 and lifts the outer periphery of the plate film 60 before the pressing unit 20 , and then drives the pressing unit 20 to loosen the plate film 60 .

[0032] The present invention designs a pressing unit 20 to press the inner side of the plate film 60 to be grasped, and then the grasping unit 10 grabs the outer periphery of the plate film 60 and lifts the outer periphery of the plate film 60 before the pressing unit 20 , so ...

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PUM

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Abstract

The invention discloses a plate and diaphragm gripping device and the method thereof, the plate and diaphragm gripping device comprises at least two gripping units, at least one pressing device positioned between the two gripping units, and a driving unit for driving the gripping units and pressing unit; when a plate and a diaphragm are gripped, the driving unit drives the pressing unit to press the inner sides of the plate and the diaphragm, drives the gripping units to grip the circumferences of the plate and the diaphragm and lift the circumferences of the plate and the diaphragm before the pressing unit acts, and then drives the pressing unit to release the plate and the diaphragm. The invention can avoid that a plurality of plates and diaphragms are lifted together, and ensure that users can grip desired plates and diaphragms and solve the problem of position deviation of adjacent plates and diaphragms.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a board film grabbing device and a method thereof. Background technique [0002] In the PCB manufacturing industry, it is usually necessary to pick, place and transport various materials and boards. For example, the automatic retractable board equipment is used to separate the individual board items one by one from the stacked PE film, copper clad laminate or inner core board, and then proceed to the next step after taking it out. [0003] The most practical situation that needs to be faced when separating single-sheet items one by one from the stacked PE film, copper-clad laminate or inner core board is: when grabbing the stacked PE film, copper-clad laminate or inner core board, due to the The reason why stacking each other makes it easy to adsorb each other is that the operation of grabbing the top single sheet film from a pile of sheet films is more difficult, beca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65H3/08H05K3/00
Inventor 韩力陈念明肖海清
Owner SHENNAN CIRCUITS
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