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Winding method and device of flip chip package

A winding method, flip-chip technology, applied in special data processing applications, instruments, electrical digital data processing, etc. problem, to achieve the effect of reducing the operation time

Active Publication Date: 2015-02-18
SYNOPSYS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, one of the disadvantages of the integer linear programming algorithm is that it takes a lot of time to calculate
For the industry that emphasizes efficiency and R&D costs, the integer linear programming algorithm does not meet the needs of use

Method used

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  • Winding method and device of flip chip package
  • Winding method and device of flip chip package
  • Winding method and device of flip chip package

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Experimental program
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Embodiment Construction

[0029] The wire winding method applied to flip-chip packaging and the device for realizing it provided by the present invention are to set the arrangement order of several outer layer pads and inner layer pads of a chip into several pad rows. Then, according to the maximum planar subset of chords, the winding trajectory is established from the innermost liner column to the outer liner line in turn, until the outer liner and the inner liner are completed. The routing of the pads, wherein the routing between each row of pads and the row of pads above it, is such that the required bypass connections are minimized. Since the chord algorithm of the most planar subsets can be calculated in the form of dynamic programming (dynamic programming) in low polynomial time (polynomial time), the winding method applied to flip-chip packaging provided by the present invention can greatly reduce the required Operation time. In addition, since the winding traces between each row of pads and th...

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Abstract

The invention relates to winding method and device applied to the flip chip package, wherein a flip chip comprises a plurality of outer liners and a plurality of inner liners. The winding method comprises the following steps of: setting a plurality of liner lines according to the arrangement sequence of the outer liner and the inner liner; and establishing a winding track from the innermost liner to the outermost liner sequentially, and selecting a winding track capable of contributing most direct connection between each liner line and the upper liner.

Description

technical field [0001] The present invention relates to a wire winding method and device, in particular to a flip-chip package (flip-chip package) wire winding method and device. Background technique [0002] With the development of manufacturing processes, today's integrated circuits have higher complexity and smaller volume than before, and this feature also increases the difficulty of chip input and output connections. Accordingly, a flip-chip packaging technology with higher integration density and more I / O pins is conceived. Flip-chip packaging is a technique for connecting a semiconductor device to an external circuit, wherein the external circuit may include a package carrier or a printed circuit board. Compared with other packaging technologies, the advantages of flip-chip packaging technology include having more area available for I / O connections, achieving higher transmission rates with less interference, and preventing external environmental factors from interfer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50H01L21/00H01L21/60
CPCH01L2924/15311H01L2224/73204H01L2224/16225H01L2224/32225
Inventor 张宸峰沈勤芳邱显仕林依洁许天彰张耀文林忠纬李柏纬
Owner SYNOPSYS INC