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Injection molded article and method of manufacturing the same

A technology of injection molding and manufacturing methods, applied in the direction of electrical components, magnetic field/electric field shielding, electrical equipment casing/cabinets/drawers, etc., can solve problems such as limited plastic resin, bending of injection molded products, thin product trends, etc., to ensure Stiffness, the effect of increasing the degree of freedom of choice

Inactive Publication Date: 2011-06-01
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as far as the method of increasing the thickness of injection molded products is concerned, it not only increases the cost of raw materials, but also goes against the trend of requiring thin products
[0004] In addition, the method of using a plastic resin reinforced with a filler such as glass fiber will not only increase the cost of raw materials, but also cause some problems in the coating process.
[0005] In addition, in the method of inserting a metal plate and injecting it, since there is a difference in thermal expansion coefficient between the plastic resin and the metal plate, there is a problem that the injection molded product is bent, and the plastic resin that can be used is limited.

Method used

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  • Injection molded article and method of manufacturing the same
  • Injection molded article and method of manufacturing the same
  • Injection molded article and method of manufacturing the same

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Embodiment Construction

[0038] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0039] figure 1 To show a schematic diagram of a plastic injection molded product according to an embodiment of the present invention, figure 2 To enlarge the schematic diagram showing the insert molding according to the embodiment of the present invention, image 3 for along figure 2 Sectional view of line III-III'.

[0040] Such as Figure 1 to Figure 3 As shown, the injection molded article 1 according to the embodiment of the present invention includes: a substrate 10 forming the appearance of the injection molded article 1 and an insert molding 20 embedded in the substrate 10 and increasing the rigidity of the injection molded article 1 .

[0041] The base material 10 may be composed of plastic resin. Plastic resins may include transparent resins, opaque resins, and translucent resins.

[0042] The base material 10...

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Abstract

The invention relates to an injection molded article and a method of manufacturing the same, wherein the rigidity of the injection molded article can be ensured and the selection free degree of the plastic resin is improved.The injection molded article of the invention is characterized by comprising the base material for forming the appearance of the injection molded article and metal wire fabrics formed inside the base material.

Description

technical field [0001] The present invention relates to an injection-molded product and a manufacturing method thereof, and more particularly, to an injection-molded product and a manufacturing method thereof capable of ensuring the rigidity of the injection-molded product and improving the degree of freedom of selection of plastic resins. Background technique [0002] For electronic products, in order to protect internal components, injection molded products used as casings are required to have a certain degree of rigidity. Common methods for securing the rigidity of injection-molded products include increasing the rigidity by increasing the thickness of the injection-molded product, increasing the rigidity by using a plastic resin reinforced with a filler such as glass fiber, or increasing the rigidity by inserting a metal plate. Ways to increase stiffness. [0003] However, as far as the method of increasing the thickness of injection molded products is concerned, not on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K9/00B29C45/14
CPCB29C45/14
Inventor 朴宣美洪锡武全必宰李朱荷李根豪
Owner SAMSUNG ELECTRONICS CO LTD
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