Load lock chamber

A sampling chamber, vacuum technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as bending and cracking of the main body of the vacuum sampling chamber

CN102097289AInactive Publication Date: 2011-06-15TES CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2011-06-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a load lock chamber capable of preventing vacuum from deformation. The load lock chamber comprises a first chamber, a second chamber and a top cover. The first chamber comprises a first bottom plate and four first side walls vertically extending from the first bottom plate, on two first side walls oppositely disposed, a first slot channel used for moving in and moving out abase plate is formed. The second chamber comprises a second bottom plate and four second side walls vertically extending from the second bottom plate, what's more, the second chamber combines the first chamber in a mode of making an upper part in an opening shape be located at a side of the first chamber. On two second side walls oppositely disposed, a second slot channel used for moving in and moving out the base plate is formed. The second chamber comprises a first reinforcing rib extending from the upper ends of the two second side walls provided with the second slot channel to the internal sides. The top cover covers the opening-shaped upper part of the first chamber, preventing vacuum deformation caused by pressure differences between laminated unit chambers to a great extent.
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Description

technical field

[0001] The present invention relates to a vacuum loading chamber (load lock chamber, also referred to as "load fixing chamber" or "loading / unloading chamber"), more specifically, before and after performing a large-area processed substrate process, Vacuum load chamber for loading and unloading substrates to be processed. Background technique

[0002] Generally speaking, when manufacturing products such as liquid crystal display devices and solar cells, it is necessary to perform various manufacturing processes such as depositing various thin films on substrates such as glass substrates and patterning the deposited thin films. And these processes are done in processing chambers that provide optimum conditions for the execution of the respective processes. Especially recently, a substrate processing system in which a plurality of processing chambers are arranged in a cluster structure so as to process a plurality of substrates in a short period of time is wide...

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Embodiment Construction

[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The above features and effects of the present invention will become clearer through the following detailed description in conjunction with the accompanying drawings, and those skilled in the art of the present invention can easily implement the technical idea of ​​the present invention. The present invention is not limited to the following embodiments, but can be realized in other ways. The role of each embodiment described in this specification is to disclose the technical content more completely and fully convey the technical ideas and features of the present invention to those skilled in the art. In the drawings, in order to clearly illustrate the present invention, the thickness of each device or film (layer) and region is exaggerated, and each device may include various additional devices not described in this specification.

[0029]...