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Ultrasonic probe having heat sink

An ultrasonic and heat sink technology, applied in the field of ultrasonic probes, can solve the problems of reducing the output of ultrasonic probes, performance deterioration, etc., and achieve the effect of preventing the deterioration of characteristics, preventing the deterioration of performance and durability, and maintaining the performance.

Inactive Publication Date: 2011-06-15
HUMANSCAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this reduces the output of the ultrasonic probe, deteriorating its performance

Method used

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  • Ultrasonic probe having heat sink
  • Ultrasonic probe having heat sink
  • Ultrasonic probe having heat sink

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Embodiment Construction

[0038] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, a detailed explanation of well-known functions and constructions will be omitted so that the present invention can be described more clearly.

[0039] figure 2 is a perspective view showing the ultrasonic probe 100 having the heat sink 150 according to the first embodiment of the present invention. image 3 is a sectional view showing the ultrasonic probe 100 having the heat sink 150 according to the first embodiment of the present invention. Figure 4 is a perspective view showing the heat sink 150 of the ultrasonic probe 100 according to the first embodiment of the present invention. As shown in the figure, the ultrasonic probe 100 with a heat sink 150 according to the first embodiment of the present invention includes an acoustic lens 110 , a matching layer 120 , a piezoelectric device 130 and a re...

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Abstract

The present invention provides an ultrasonic probe which includes a heat sink (150) provided in a rear layer (140) to dissipate heat. The heat sink is coupled to a rear surface (141) of the rear layer such that contact areas there between are increased. The heat sink includes a plurality of heat conductive protrusions (151) on one surface thereof. The heat conductive protrusions are inserted into respective heat conductive depressions (142) formed in the rear layer. Each heat conductive depression has a shape corresponding to the respective heat conductive protrusion. Preferably, each heat conductive protrusion has a bar shape.

Description

technical field [0001] The present invention relates to ultrasonic probes in general, and more particularly, to an ultrasonic probe having a heat sink that prevents deterioration of piezoelectric device characteristics, thereby preventing deterioration of ultrasonic probe performance and durability, and also prevents acoustic lens become overheated, thereby reducing the temperature of the ultrasound probe surface in contact with the patient. Background technique [0002] In general, an ultrasound imaging apparatus mainly includes an ultrasound probe converting between electrical signals and ultrasound signals, a signal processing unit processing transmitted or received signals, and a display expressing images using signals received from the ultrasound probe and the signal processing unit. [0003] The ultrasound probe that performs signal conversion is a very important part that determines the quality of ultrasound images. Specifically, ultrasound probes convert between ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/00
CPCA61B8/00G10K11/004A61B8/546A61B8/4483G01N29/24G01N29/00
Inventor 林圣珉
Owner HUMANSCAN