Unlock instant, AI-driven research and patent intelligence for your innovation.

Adhesive composition for semiconductor device and die attach film

A chip mounting and semiconductor technology, applied in semiconductor/solid-state device manufacturing, transportation and packaging, adhesives, etc., can solve problems such as low tensile strength of chip mounting film, failure of picking process, etc.

Inactive Publication Date: 2014-01-29
CHEIL IND INC
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method results in low tensile strength of the die attach film, which can lead to film cut-off during the dicing process or failure of the pick-up process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive composition for semiconductor device and die attach film
  • Adhesive composition for semiconductor device and die attach film
  • Adhesive composition for semiconductor device and die attach film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3 and comparative example 1

[0047] Embodiment 1~3 and comparative example 1: the preparation of adhesive composition

[0048] As shown in Table 1, each component was dissolved in cyclohexanone as an organic solvent to prepare a binder composition.

[0049] Table 1

[0050]

[0051] Note:

[0052] (1) Elastomer resin: SG-P3, Nagase Chemtex

[0053] (2) Epoxy resin: YDCN-500-90P, Kukdo Chemical

[0054] (3) Epoxy resin: YSLV-80XY, Kukdo Chemical

[0055] (4) Epoxy resin: EPPN-501H, Nippon Kayaku

[0056] (5) Curable phenolic resin: HF-1M, Meiwa Kasei

[0057] (6) Curable amino resin: DDS, Wako chemical

[0058] (7) Silane coupling agent: KBM-403, Shinetsu

[0059] (8) Curing accelerator: TPP-K, HOKKO

[0060] (9) Packing: R-972, Degussa

[0061] *Using cyclohexanone as an organic solvent

[0062] Formation of the adhesive layer

[0063] Each composition was kneaded with a ball mill, coated with a coater on a release-treated polyethylene terephthalate (PET) film as a base layer, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

An adhesive composition for a semiconductor device and a die attach film for a semiconductor device, the adhesive composition including about 50 to about 80 parts by weight of an elastomeric resin; about 10 to about 20 parts by weight of an epoxy resin, the epoxy resin including a difunctional epoxy resin and polyfunctional epoxy resins and the difunctional epoxy resin being present in an amount of about 20 to about 60 parts by weight with respect to 100 parts by weight of the epoxy resin; about 1 to about 10 parts by weight of a curable resin; about 0.01 to about 10 parts by weight of a curing accelerator; about 0.01 to about 10 parts by weight of a silane coupling agent; and about 5 to about 10 parts by weight of a filler.

Description

technical field [0001] The invention relates to semiconductor packaging technology. More particularly, the present invention relates to an adhesive composition for a semiconductor device capable of suppressing void formation, and a die attach film including the adhesive composition. Background technique [0002] In order to keep up with the trend of smaller and highly integrated semiconductor devices, a die attach film (DAF) has been introduced for laminating semiconductor chips to each other or sticking semiconductor chips to a substrate in a dicing process. For semiconductor assembly, die attach films are used to support the wafer during the sawing process to cut the wafer into individual wafers, pick up the wafer during the pick-up process, and secure the wafer during the dicing process. One of the picked up wafers is fixed on a package substrate or on another wafer in a state where an adhesive layer is bonded to its lower surface. The adhesive layer is used to maintain...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J201/00C09J133/00C09J163/00C09J163/02C09J163/04C09J7/02H01L21/68
CPCC08G59/38C08L63/04C08L63/00C09J163/00C08L2205/02C08L21/00Y10T428/287C09J7/35C09J7/22C09J2203/326
Inventor 崔裁源金振万宋基态
Owner CHEIL IND INC