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Bonding composition

A composition and alloy technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of joint strength reduction, iron dissolution, alloy composition change, etc.

Inactive Publication Date: 2011-07-13
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As mentioned above, when joining with the conventional Sn alloy-based joining composition, coarse intermetallic compounds are formed on the joint interface, so there are problems such as a reduction in joint strength due to embrittlement and cracks during cooling.
In addition, there is the following problem: in various production equipment using this joining composition, due to the contact reaction between the molten Sn-based alloy composition and iron-based equipment, iron will be eluted, thereby reducing the life of the equipment. decreased, or the composition of the alloy composition changes, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] According to the Japanese Industrial Standard "JIS Z 3198-5" lead-free solder test method, such as figure 1 As shown, a joining composition 12 composed of Sn-0.1 wt% Ge-0.1 wt% Si with a thickness of 100 μm is inserted into the joint portion of two joined members 10 and 11 made of iron-based material (SS400), After dropping the flux, it was heated for 90 seconds in a nitrogen atmosphere at a temperature of 250° C. to join the members 10 , 11 to be joined together. Using the joined members 10 and 11 joined with the joining composition 12, a No. 1 shear test piece according to "JIS Z 3198-5" was prepared.

[0064] The parts to be joined 10, 11 and the joining composition 12 in the shear test piece were analyzed using a scanning electron microscope (SEM; Scanning Electron Microscope) and an electron probe X-ray microanalyzer (EPMA; Electron Probe Micro-Analysis). The bonding interface was observed and analyzed. Here, the electron probe X-ray microanalyzer is a device tha...

Embodiment 2

[0079] The shear test piece used in Example 2 has the same configuration as the shear test piece used in Example 1, except that Sn-0.7 wt% Cu-0.05 wt% Ge-0.05 wt% Si was used as the joining composition 12 same.

[0080] Also, in the same manner as in Example 1, the bonding interface between the members 10 and 11 to be bonded and the bonding composition 12 in the shear test piece was observed and analyzed using a scanning electron microscope and an electron probe X-ray microanalyzer. In addition, under the same experimental conditions as in Example 1, a shear test was performed using this shear test piece.

[0081] Figure 4 It is a schematic diagram showing the results of observation and analysis of the bonding interface between the members 10 and 11 to be bonded and the bonding composition 12 in the shear test piece. in addition, Figure 4 The joint interface on the joined member 10 side is shown in , but the same results as the joint interface on the joined member 10 side...

Embodiment 3

[0085] The shear test piece used in Example 3 has the same configuration as the shear test piece used in Example 1 except that Sn-3.5% by weight Ag-0.05% by weight Ge-0.05% by weight Si was used as the joining composition 12 same.

[0086] Also, in the same manner as in Example 1, the bonding interface between the members 10 and 11 to be bonded and the bonding composition 12 in the shear test piece was observed and analyzed using a scanning electron microscope and an electron probe X-ray microanalyzer. In addition, under the same experimental conditions as in Example 1, a shear test was performed using this shear test piece. In addition, since it can be known from the analysis results of Example 3 that it has the same Figure 4 The reaction layer formation structure of the shown embodiment 2 is the same as the reaction layer formation structure, so reference is made here to Figure 4 Be explained. Here, the same reaction layer formation structure as in Example 2 means that ...

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Abstract

A bonding composition (12) contains Ge of 0.01-1 wt% and Si of 0.01-1 wt%, and the rest is composed of Sn or a Sn alloy. The bonding composition (12) has excellent bonding strength.

Description

technical field [0001] The present invention relates to a composition for joining that is excellent in joint strength and joint reliability. Background technique [0002] The bonding composition plays an important role of mechanically and electrically connecting multiple unit parts used in severe environments such as power control computer substrates, home appliances, and personal computers, such as thermal cycles, mechanical shocks, and mechanical vibrations. . For unit parts joined using such a joining composition, improvement of mechanical strength such as joint strength and thermal fatigue strength, and improvement of physical properties such as wettability are required. [0003] Since solder as a joining composition is mainly used after melting, it may react with oxygen contained in air or molten solder to generate a large amount of oxides. Therefore, problems such as reduction in mechanical strength arise. In order to solve this problem, for example, Japanese Patent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C12/00C22C13/00
CPCB23K35/262B23K35/264C22C13/02B32B15/01C22C12/00C22C13/00
Inventor 龙坦桐久里裕二
Owner KK TOSHIBA