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Gate valve and substrate processing apparatus using the same

A substrate and gate valve technology, applied in the field of substrate processing devices, can solve the problems of installation position deviation, installation error, inability to maintain the sealing effect of sealing members, etc., and achieve the effect of improving the sealing effect

Active Publication Date: 2011-08-10
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when there are a plurality of parts that contact the valve body, such as the valve body driving roller, there may be slight deviations in the mounting positions due to mounting errors of each member.
In this case, since there is a deviation between the substrate loading and unloading port and the valve body, there is also concern that the sealing effect of the sealing member cannot be maintained when the deviation is large.

Method used

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  • Gate valve and substrate processing apparatus using the same
  • Gate valve and substrate processing apparatus using the same
  • Gate valve and substrate processing apparatus using the same

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Embodiment Construction

[0027] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the structural element which has substantially the same functional structure, and repeated description is abbreviate|omitted.

[0028] (gate)

[0029] First, a gate valve according to an embodiment of the present invention will be described with reference to the drawings. Figure 1A , Figure 1B , Figure 1C, Figure 2A , Figure 2B , Figure 2C It is a figure for demonstrating the structure of the gate valve of this embodiment. In this embodiment, as Figure 1A , Figure 1B The gate valve 200 shown is taken as an example. This gate valve 200 has a valve body 210 of a size capable of opening and closing the substrate loading and unloading port 112 of the chamber 100. The gate valve 200 opens and closes the substrate loading and unloading by driving the va...

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Abstract

The invention provides a gate valve and a substrate processing apparatus using the same, which can slightly adjust the gap between a wall face at the periphery of a substrate moving in / out opening and a valve body. The gate valve (200) is structured in a manner that the valve body (201) advances and retreats by means of a cam mechanism (260), and the substrate moving in / out opening (112) is opened or closed. The cam mechanism comprises an elongated component (261) which slides freely along a direction orthogonal to an advancing and retreating direction of the valve body, a plate-shaped cam (270) which is disposed between the elongated component and the valve body and converts the sliding motion of the elongated component into the advancing and retreating motion of the valve body, a valve body drive component (280) which abuts against the valve body with the plate-shaped cam, and goes in and out of the valve body through the sliding along the advancing and retreating direction of the valve body, and a gap adjusting component (310) which is disposed on a top end face of the valve drive component abutting against the valve body, and is used for adjusting the gap between the valve body and the substrate moving in / out opening.

Description

technical field [0001] The present invention relates to a gate valve for opening and closing a loading and unloading port of a substrate, and a substrate processing apparatus using the gate valve. Background technique [0002] In a substrate processing apparatus that performs predetermined processes such as etching and film formation on substrates such as semiconductor wafers and FPD (Flat Panel Display) substrates such as liquid crystal substrates, there are substrate loading and unloading ports for transferring substrates, and multiple openings for closing substrate loading and unloading. In the state of the export port, the interior is a chamber with a vacuum atmosphere. As such a chamber, for example, a process chamber (including a reaction vessel) in which a substrate is processed in a vacuum atmosphere, a transport chamber in which a substrate is transported in a vacuum atmosphere, a loading chamber in which a substrate is exchanged between a vacuum atmosphere and an a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16K3/16F16K51/02F16K3/316H01L21/00H01L21/677
CPCC23C16/4409F16K3/184F16K51/02H01L21/67739
Inventor 远藤健一
Owner TOKYO ELECTRON LTD